With the invention of the world’s first double-sided alignment system in 1985, EV Group revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This separation results in higher flexibility and universal application of the wafer bonding equipment. EVG’s bond alignment systems offer the highest precision, flexibility and ease of use, and modular upgrade capability, and have been qualified in numerous high-throughput production environments. The precision of EVG bond aligners accommodates the most demanding alignment processes.
Manual bond alignment system for wafer-to-wafer alignment suitable for academia and industrial research.
Automated bond alignment system for wafer-to-wafer alignment for research and pilot production.
Automated bond alignment system for wafer-to-wafer alignment for pilot and volume production.
Fully automated bond alignment system for universal alignment with proprietary method for micron-level face-to-face wafer alignment.