Press Center

21.05.2019

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

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15.05.2019

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey

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19.03.2019

EV Group Partners with NSI to Enable First Wafer-Level Heterogeneous Integration of GaAs on Silicon for RF Front-End Module Manufacturing

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12.03.2019

イーヴィグループとパナソニック
プラズマダイシング工程におけるレジスト塗布ソリューションを提供

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05.12.2018

公益財団法人 電磁材料研究所が次世代磁気デバイス研究開発用途に EVGのマスクアライメント装置を導入

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05.12.2018

イーヴィグループジャパンが山梨大学にマイクロ流体デバイス作製向けマスクアライナーを導入

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11.12.2018

EV Groupが「More Moore」スケーリングおよびフロントエンドプロセス向け 次世代フュージョン接合装置を発表

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11.11.2018

IHP – Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temperature Covalent Wafer Bonding Technologies for Developing Next-Gen Communication Devices

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11.11.2018

EV Group partners with Plessey to drive GaN-on-Silicon monolithic microLED technology for AR applications

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03.07.2018

EV Group、画期的なウェーハ接合技術により3D-ICパッケージングロードマップを牽引

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19.06.2018

EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey

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17.05.2018

EV Group、ウェーハレベルオプティクス製造ソリューションの拡張により、革新的なフォトニックデバイスや医療向けアプリケーションが可能に

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01.05.2018

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

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25.04.2018

WaveOptics collaborates with EV Group to drive augmented reality (AR) manufacturing at scale

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02.04.2018

Converts One-third of the Sunlight into Electricity: 33.3 Percent Silicon-based Multi-junction Solar Cell

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26.03.2018

EV Group と IBM がレーザー剥離技術のライセンス契約で合意

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18.01.2017

ベルギーの国際研究機関ImecとEVG、ウェーハ接合で 1.8µmピッチのオーバーレイ精度を初めて実証

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12.11.2017

Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding With 1-Micron Pitch On EV Group System

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08.10.2017

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures With Single-Nanometer Accuracy

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10.09.2017

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-level Optics Manufacturing

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04.07.2017

EV Group Unveils Breakthrough Low-Temperature Laser Debonding Solution for Fan-out Wafer-Level Packaging

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03.04.2017

EV Group Honored As Most Innovative Company in Austria

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08.03.2017

EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging

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11.07.2016

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

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06.07.2016

EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing

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06.07.2016

EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing

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