SmartView® NT

Automated Bond Alignment System for Universal Alignment

Fully automated bond alignment system for universal alignment with proprietary method for micron-level face-to-face wafer alignment

The SmartView NT automated bond alignment system for universal alignment offers a proprietary method for micron-level face-to-face wafer-level alignment. This alignment technique is key to achieving the required accuracy in multiple wafer stacks for leading-edge technologies. SmartView technology can be combined with the GEMINI wafer bonding systems for subsequent permanent bonding in a fully automated platform.

Features

  • Suitable for automated and integrated EVG bonding systems (EVG560®, GEMINI®) in 200 mm and 300 mm configurations
  • Wafer stacking for 3D interconnect, wafer-level packaging and high-volume MEMS devices
  • Universal bond aligner (face-to-face-, backside-, infrared- and transparent alignment)
  • No Z-axis motion and no refocusing required
  • Windows® based user interface
  • Bond pairs are aligned and clamped prior to loading into the bond chamber
  • Manual or fully automated configurations (e.g. integration with GEMINI®)
  • Options
    • Can be combined with the EVG®500 series wafer bonding systems, EVG®300 series cleaning systems and EVG®810 LT plasma systems for a fully automated wafer-to-wafer alignment operation with cassette-to-cassette operation
SmartView NT

Technical Data

Substrate / Wafer parameters (mm)
Size: 150 - 200, 200 - 300
Thickness: 0,1 - 5
Max. stack height: 10
Automatic alignment
Standard
Handling system
3 cassette stations (up to 200 mm) or 2 FOUP load ports (300 mm)

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