Optical lithography, the structuring of photosensitive materials by mask-defined light for subsequent semiconductor processes, is a well-known and established technology. Today’s main requirements for optical lithography are defined by several key parameters. Sub-micron alignment accuracy, controlled uniform proximity gap between mask and wafer, as well as a clearly defined and precisely controlled exposure spectrum corresponding to the resist sensitivity, are among the most important criteria taken into account. Additionally, EVG´s customer-focused approach includes customized solutions for dedicated process needs. Understanding special requirements and having the flexibility to adapt our systems accordingly are among the unique core competences that EVG brings to the marketplace while constantly enhancing its lithography portfolio.