EVG’s Heterogeneous Integration Competence Center is designed to assist customers in leveraging EVG’s process solutions and expertise to enable new and enhanced products and applications driven by advances in system integration and packaging. These include solutions and applications for high performance computing and data centers, the Internet of Things (IoT), autonomous vehicles, medical and wearable devices, photonics and advanced sensors.
EVG’s new HI Competence Center provides an open access innovation incubator for our customers and partners across the microelectronics supply chain to collaborate while pooling our solutions and process technology resources to shorten development cycles and time to market for innovative devices and applications enabled by heterogeneous integration.
EVG Heterogeneous Integration Competence Center™ Open Access Innovation Incubator
Fusion and Hybrid Bonding for W2W and D2W Bonds
Aligned Metal Bonding
Temporary Bonding and Debonding Open Platform
Advanced Resist Processing
Maskless Exposure Technology
EVG’s HI Competence Center is designed to help enable new products and applications driven by advances in system integration and packaging. Shown here: chiplet integration by collective die-to-wafer hybrid bonding.
The Heterogeneous Integration Competence Center™ combines EV Group’s world-class wafer bonding, thin-wafer handling, and lithography products and expertise, as well as pilot-line production facilities and services at its state-of-the-art cleanroom facilities.