EVG®805

Debonding System

Thin wafer debonding

The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.

Features

  • Open adhesive platform
  • Debond Options:
    • Thermal slide off debonding
    • Lift off debonding
    • Mechanical debonding
  • Recipe controlled system  
  • Real time monitoring and recording of all relevant process parameters
  • Unique features for thin-wafer handling
  • Various chuck designs to support wafer/substrates and carriers up to 300 mm
  • High topography wafer handling
EVG805

Technical Data

Wafer diameter (substrate size)
Up to 300 mm wafer
Up to 12” film frame
Configuration
1 debond module
Options
UV-assisted debonding
High topography wafer handling
Bridge capability for different substrate sizes

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