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Press Center
03.12.2018
EV Group Unveils Next-Generation Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing
12.11.2018
IHP – Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temperature Covalent Wafer Bonding Technologies for Developing Next-Gen Communication Devices
12.11.2018
EV Group partners with Plessey to drive GaN-on-Silicon monolithic microLED technology for AR applications
03.07.2018
EV Group Accelerates 3D-IC Packaging Roadmap With Breakthrough Wafer Bonding Technology
20.06.2018
EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey
15.05.2018
EV Group Secures Lithography Order from VTT Technical Research Centre for More Than Moore Applications
02.05.2018
EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity
26.04.2018