DI Erich Thallner Strasse 1
4782 St. Florian am Inn
Austria
Press Center
21.05.2019
EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019
20.03.2019
EV Group Partners with NSI to Enable First Wafer-Level Heterogeneous Integration of GaAs on Silicon for RF Front-End Module Manufacturing
13.03.2019
EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing
03.12.2018
EV Group Unveils Next-Generation Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing
12.11.2018
IHP – Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temperature Covalent Wafer Bonding Technologies for Developing Next-Gen Communication Devices
12.11.2018
EV Group partners with Plessey to drive GaN-on-Silicon monolithic microLED technology for AR applications
03.07.2018
EV Group Accelerates 3D-IC Packaging Roadmap With Breakthrough Wafer Bonding Technology
20.06.2018