The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission allows void detection down to a radius of 500 µm which is a perfect match for fusion bonding processes. In addition, the infrared inspection system supports bond strength measurements using the Maszara method.
IR live image
One-shot high-resolution inspection of the entire bonded wafer
Optional bond pin for live visualization of bond wave propagation
Fully automated bond strength measurement (Maszara test)