Automated single wafer cleaning system for efficient removal of particles
The EVG320 automated single wafer cleaning system handles wafers and substrates automatically between the process stations. The robot handling system ensures pre-alignment and loading of the wafers automatically in a cassette-to-cassette or FOUP-to-FOUP operation.
Features
- Available for aqueous based cleaning applications such as silicon direct bonding
- Available for solvent based cleaning applications such as post-debond cleans
- Up to four cleaning stations
- Fully automated cassette-to-cassette or FOUP-to-FOUP handling
- Edge handling for double-sided cleaning processes available (option)
- High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
- Advanced remote diagnostics
- Prevents cross-contamination from back to front side
- Fully software-controlled cleaning process
Technical Data
| Wafer diameter (substrate size) |
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| 200, 100 - 300 mm |
| Cleaning system |
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| Open chamber, spinner and cleaning arm |
| Chamber: made of PP or PFA (option) |
| Cleaning media: DI-water (standard), other cleaning media (option) |
| Spinner chuck: vacuum chuck (standard) and edge handling chuck (option) made of metal ion free and clean materials |
| Rotation: up to 3000 rpm (in 5 sec) |
| Megasonic nozzle |
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| Frequency: 1 MHz (3 MHz option) |
| Output power: 30 - 60 W |
| DI-water flow rate: up to 1.5 liter/min |
| Effective cleaning area: Ø 4.0 mm |
| Material: PTFE |
| Megasonic area transducer |
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| Optional |
| Frequency: 1 MHz (3 MHz option) |
| Output power: max. 2.5 W/cm² active areas (max. output 200 W) |
| DI-water flow rate: up to 1.5 liter/min |
| Effective cleaning area: triangle shape that guarantees radio uniformity on whole wafers per each rotation |
| Material: SS and sapphire |
| Brush |
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| Material: PVA |
| Programmable parameters: brush and wafer speed (rpm) |
| Adjustable parameters (brush compression, media dispense) |
| Automated wafer handling system |
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| The field proven class 1 compatible wafer handling robot on EVG®320 enables 24 hour automated cassette-to-cassette or FOUP-to-FOUP operation for the highest throughput. Surfaces in contact with wafers do not cause any metal ion contamination. |
| Optional features |
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| ISO 3 mini-environment (according to ISO 14644) |
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