Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
Industry’s first commercially available hybrid bond activation and cleaning system for direct placement (DP) die-to-wafer (D2W) bonding
High volume manufacturing system for collective die-to-wafer (Co-D2W) bonding