EVG®120 Automated Resist Processing System

Compact, cost effective system for start of production and limited cleanroom space.


  • Max. wafer size: 200 mm
  • Max. number of spin modules (coat/develop): 2
  • Max. number of further modules (hot plates, chill plates, vapor prime): 10
  • Spray coating:
    Spray nozzle programmable parameters: Speed (rpm), acceleration (rpm/s),
    absolute position
    Park position and dummy dispense
  • Spin coating:
    Drive unit up to 10.000rpm, ramp-up speed up to 40.000 rpm/s
    Park position and dummy dispense
  • Developing:
    Pressurized tank, flow control
    Nitrogen nozzle for atomizing developer in spray mode; also suitable for puddle
    and stream (rinse) develop
    Park position and dummy dispense
  • Max. hotplate temperature: 250 °C
  • Automation options:
    Resist pumps for spin coating:
    - For resist viscosities up to 50000cP
    - Up to 15ml dispense volume, up to 5ml/s dispense rate
    - Programmable suckback for best uniformity
    Resist pumps for spray coating:
    - Precise flow control 10µl/s up to 200µl/s for low viscosity resist