Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.
Please click the player window to start the video.
EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging
Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding
more news ..
2017 NCAP & Yole Développement Symposium on Advanced Packaging & System Integration Technology
MEMS Engineer Forum 2017
more events ..
Nemotek Technologie selects EV Group's Solutions for Capacity Ramp
EV Group Strengthens Presence in Middle East
EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology
Solutions for R&D
EV Group Corporate Video