Fast void inspection of bonded wafer stacks
The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG20 tool or as a station in EVG's integrated bonding systems.
Features
- Live imaging
- One-shot inspection of the entire wafer
- Optional bond pin for live visualization of direct bonding
- Maszara test compatible
- Void size detection down to 0.5 mm radius
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