EV Group技术

技术

For nearly 40 years, EVG has provided industry-leading process technologies and solutions that have enabled innovations in advanced packaging, optics and photonics, sensors and bio-medical devices and applications.

True to our Triple-i philosophy of “Invent”, “Innovate” and “Implement”, our core lithography, wafer bonding and metrology technologies enable manufacturers to develop the latest micro- and nanotechnology device breakthroughs, and then bring them into high-volume production, cost effectively and at high process yields.

Core technologies

MLE™ - MaskLess Exposure
MLE™ - 无掩模曝光技术

Moving beyond traditional mask-based lithoghraphy toward digital lithography technology

纳米压印光刻(NIL)- SmartNIL®

A large-area soft UV-nanoimprint lithography process for high-volume manufacturing

晶圆级光学

Market-leading WLO manufacturing portfolio, including step-and-repeat mastering, lens molding, nanoimprint lithography and stacking

EVG Optical Lithography
光刻技术

The most complete technology portfolio, supporting a maximum range of requirements in optical lithography

涂胶工艺技术

Resist processing technology together with patterning are the most repeated steps in semiconductor manufacturing

临时键合和解键合

Temporary bonding and debonding enabling backside processing for 3D integration

共晶键合

Eutectic wafer bonding for reliable hermetic sealing

瞬态液相(TLP)键合

Low-temperature metal wafer bonding by Transient Liquid Phase (TLP)

阳极键合

Anodic bonding for interlayer-free Si-glass bonding

金属扩散键合

Metal diffusion bonding for precise interfaces and alignment

融熔和混合键合

Fusion and Hybrid Bonding for engineered substrates and 3D device integration

Die-to-Wafer Fusion and Hybrid Bonding

Collective and direct-placement die-to-wafer bonding

EVG ComBond®
ComBond® 技术

A breakthrough technology driving the bonding of “anything on anything” enabling emerging and “beyond CMOS” device designs

EVG Metrology
量测

Process control and optimization for lithography and bonding