The IQ Aligner® NT is optimized for zero-assist contactless proximity processing at highest throughput.
The IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. Featuring a highly sophisticated print gab control and zero-assist dual-size wafer processing capability, the system fully addresses high-volume manufacturing (HVM) needs. It provides an up to 2X increase in throughput and a 2X improvement in alignment accuracy over EVG’s previous-generation IQ Aligner system, giving it the highest throughput of all mask aligners. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems growing out of the highest throughput supported on mask alignment tools. With advanced wafer alignment run-out control, full-field mask movement capability and high-power UV light source, it is ideally suited for wafer bumping and interposer patterning, thereby serving a variety of advanced packaging types, including wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP), 3D-IC/through-silicon via (TSV), 2.5D interposers, and flip chip.
Features
- Zero assist bridge tool - dual substrate concept supporting flexibility of production for 200 mm and 300 mm
- Unmatched throughput (first print / aligned) up to 140 wph
- Cutting-edge alignment accuracy
- Top-side alignment down to 250 nm
- Back-side alignment down to 500 nm
- Full Clearfield Mask Movement (FCMM) for flexible pattern positioning and compatibility for darkfield mask alignment
- Contact-free in-situ mask-to-wafer proximity gap verification
- Excellent run-out compensation thanks to ultra-flat and fast response temperature-controlled wafer chuck
- Manual substrate loading capability
- Rework sorting wafer management and flexible cassette system
- Remote tech support and GEM300 compatibility
- Smart process control and data analysis feature [Framework Software Platform]
- Integrated analysis features for process and machine control
- Equipment and process performance tracking feature
- Parallel/queueing task processing feature
- Smart handling features
- Occurrence and alarm analysis
- Smart maintenance management and tracking
Technical Data
| Throughput |
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| throughput (first print / aligned) up to 140 wph |
| Industrial automation features |
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| Cassette / SMIF / FOUP / SECS/GEM / thin, bowed, warped, edge wafer handling |
| Smart process control & data analysis features (framework SW platform) |
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| Integrated analysis features for process and machine control |
| Parallel task / queueing task processing feature |
| Equipment and process performance tracking feature |
| Smart handling features |
| Occurences & alarms analysis / smart maintenance management & tracking |
| Wafer diameter (substrate size) |
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| Up to 300 mm |
| Alignment modes |
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| Top side alignment: ≤ ± 0,25 µm |
| Bottom side alignment: ≤ ± 0,5 µm |
| IR alignment: ≤ ± 2,0 µm / substrate material depending |
| Exposure setup |
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| Hard contact / soft contact / proximity mode / flex mode |
| Wedge compensation |
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| Fully automatic - SW controlled |
| Contactless |
| Exposure options |
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| Interval exposure / flood exposure |
| Advanced alignment features |
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| Automatic alignment |
| Darkfield alignment capability / full clearfield mask movement (FCMM) |
| Large gap alignment |
| Run-out control alignment |
| System control |
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| Operations system: Windows |
| File sharing & back-up solution / unlimited no. recipes & parameters |
| Multi-language user GUI & support: CN, DE, FR, IT, JP, KR |
| Real-time remote access, diagnostics & troubleshooting |
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