LITHOSCALE Maskless Exposure System from EV Group Wins 2021 BEST OF WEST Award

© Courtesy of SEMI and Semiconductor Digest

Pete Singer, Semiconductor Digest Editor-in-Chief, presents the 2021 BEST OF WEST award to Dave Kirsch, Vice President & General Manager North America (left) and Garrett Oakes, Technology Director North America of EV Group

EVG Group's LITHOSCALE® Maskless Exposure System brings the benefits of digital lithography to high-volume manufacturing.

SAN FRANCISCO, Calif. – December 8, 2021 – The LITHOSCALE® maskless exposure system from EV Group (EVG) has won the 2021 Best of West award, SEMI and Semiconductor Digest announced today at SEMICON West 2021 Hybrid, December 7-9 at the Moscone Center in San Francisco. EVG is a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets.

Presented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.

LITHOSCALE is designed to address backend lithography needs for markets and applications requiring a high degree of flexibility or product variation, including semiconductor advanced packaging, MEMS, biomedical and PCB manufacturing. The first product platform to feature EVG’s revolutionary MLE™ (Maskless Exposure) technology, LITHOSCALE combines high-resolution (<2 microns L/S) with no exposure field limitations, powerful digital processing that enables real-time data transfer and immediate exposure, and a highly scalable design that supports high-volume manufacturing.

The system’s high precision is matched by distortion-free high-intensity optics and subnanometer-range stage motion accuracy, which ensures seamless projection across the entire substrate. LITHOSCALE also employs dynamic alignment modes and die-level compensation with automatic focus in order to adapt to the substrate material and surface variations. The result is the world’s first maskless lithography system for high-volume manufacturing (HVM) with up to a 5X increase in throughput compared to existing maskless exposure systems in the market.

“Semiconductor manufacturers have long relied on the ingenuity of equipment suppliers such as EV Group to make chips smaller and faster,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. “The LITHOSCALE maskless exposure systems is a great example of the know-how that’s on display at SEMICON West this year.”

The EVG Group will receive the Best of West award today at SEMICON West 2021 Hybrid.

About Semiconductor Digest

Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest (, is dedicated to providing global information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Semiconductor Digest consists of a website, magazine and topic-focused newsletters.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Michael Hall/SEMI

Phone: 1.408.943.7988



Scott Stevens, Cardinal Communications for SEMI Americas

Phone: 1.512.288.4050



Semiconductor Digest Contact

Pete Singer, Editor-in-Chief

Phone: 1.978.470.1806