To complete EVG’s lithography and bonding portfolio, sufficient metrology is necessary to ensure process control and (in combination with feedback loops) also allow for process parameter optimization like bond alignment. Versatile measurement options are available to meet the metrology requirements for a wide variety of applications. These tools can fit in HVM and R&D environments.
Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. Advanced packaging, MEMS and photonic applications are gaining importance, very often lacking suitable metrology solutions for essential processing steps. Furthermore, overall performance of the device is determined by packaging and back-end-of-line processes; hence, process requirements are getting tighter and need further metrology. EVG’s metrology solutions for wafer inspection and evaluation are optimized for lithography and all types of bonding applications. As one example, metrology prior to non-reworkable processes like wafer thinning after temporary bonding directly leads to increased yield and process security, where an integrated feedback loop results in a reduction of high-cost wafer scrap.
Register now for the EVG Technology Day in Taiwan at the Hsinchu Ambassador Hotel on March 29 ,2023!
Visit our Booth and our talk "Nanoimprint Lithography: Ideal Manufacturing Technology for Advanced Photonic Devices” at the NIL Industrial Day from 17th of April - 18th of April!
Visit us at our booth at the CS / PIC and PE International Conference and listen to our talks "Nanoimprint Lithography (NIL) - How to apply for PIC manufacturing and packaging?" & “Wafer bonding: technology that enables microLED microdisplays".