The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.
Open adhesive platform
Thermal slide off debonding
Lift off debonding
Recipe controlled system
Real time monitoring and recording of all relevant process parameters
Unique features for thin-wafer handling
Various chuck designs to support wafer/substrates and carriers up to 300 mm