The EVG320 D2W is a highly flexible platform that features a universal hardware/software interface to enable seamless integration with third-party pick-and-place die bonding systems. It also can operate as a stand-alone system depending on integration and line balancing requirements. The system incorporates EVG’s advanced cleaning and plasma activation technology, which is available across its industry-standard W2W fusion and hybrid bonding platforms and has been proven in hundreds of installed modules worldwide. In addition, the EVG320 D2W features EVG’s alignment verification module (AVM), an integrated metrology module that provides direct feedback to the die bonder on critical process parameters, such as die placement accuracy and die-height information as well as post-bond metrology, for improved process control. It also features flexible substrate handling that can accommodate any type of die carrier or film frame that can support plasma activation, hybrid and fusion bonding cleanliness standards, and SECS/GEM standard support.
Up to six process modules
Fully automated cassette-to-cassette or FOUP-to-FOUP handling
Universal die carrier input including film frame and customized carrier formats
Universal hardware/software interface to enable seamless integration with third-party pick-and-place die bonding systems
Industry standard cleaning and activation modules for fusion and hybrid bonding
Metrology modules allowing feed-forward and feed-back loop to host and connected pick-and-place die bonding systems