EVG®540

Automated Wafer Bonding System

Fully automated wafer bonding system for substrates up to 300 mm

The EVG540 automated wafer bonding system is an automated single-chamber production bonder designed for pilot-line manufacturing as well as R&D for high-volume manufacturing in wafer-level packaging, 3D-interconnect and MEMS applications. Based on a modular design, the EVG540 provides a proven solution for future transition of wafer bonding processes from R&D to large-scale manufacturing on our fully integrated production bonding systems.

Features

  • Single-chamber bonder up to 300 mm substrate size
  • Compatible with SmartView® and MBA300
  • Automatic handling of up to four bond chucks
  • Compliant to high safety standards
EVG540

Technical Data

Maximum heater size (mm)
300
Loading chamber
2-axis robot
Max. bond chambers
2

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