Press Center

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications  

2017_06_PlasmaDicing_1_ThumbnailST. FLORIAN, Austria, June 20, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG's latest products and process development services support this emerging semiconductor back-end fabrication process by protecting bumps and other topography with highly uniform resist layer and lithographic patterning of narrow dicing streets.

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EV Group Expands Production Capacity at Corporate Headquarters in Austria  

2017_05_TestroomBuilding_1_ThumbnailST. FLORIAN, Austria, May 31, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment, the expansion will include the construction of a new building that provides additional production and test capacity for EVG equipment that meets the high cleanliness requirements of the semiconductor industry, as well as that allows for a significant expansion of warehouse space.

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Customers Have Voted EV Group One Of The World's Best Suppliers In The VLSIresearch 2017 Customer Satisfaction Survey  

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ST. FLORIAN, Austria, May17, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that customers have once again voted the company one of the 10 BEST FOCUSED SUPPLIERS OF CHIP MAKING EQUIPMENT and one of the 2017 THE BEST SUPPLIERS OF FAB EQUIPMENT in the 2017 VLSIresearch Customer Satisfaction Survey, increasing its rankings in both award segments compared to last year. EVG also received a RANKED 1st in SPECIALTY FAB EQUIPMENT award again this year. In addition, EVG was recognized as one of THE BEST SUPPLIERS OF FAB EQUIPMENT TO SPECIALTY CHIP MAKERS a new award category introduced in this year's Customer Satisfaction Survey.


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EV Group Achieves Industry Milestone With More Than 1100 Wafer Bond Chambers Installed Worldwide  

2017_05_WaferBonding_EVG560(300mm)_ThumbnailST. FLORIAN, Austria, May 16, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved an industry milestone with more than 1100 EVG wafer bonding chambers installed at customer facilities worldwide to date. This milestone cements EVG's technology and market leadership in wafer bonding, which is an enabling process for volume manufacturing of semiconductor advanced packaging, MEMS, CMOS image sensors, and radio frequency (RF) devices.

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EV Group Honored As Most Innovative Company in Austria  

2017_03_Innovationspreis_ThumbnailST. FLORIAN, Austria, April 4, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received the 2017 Austrian Innovation Award, known as the "Staatspreis Innovation 2017," for the development of EVG's groundbreaking SmartNIL® nanoimprint lithography technology for micro- and nano-structuring of wafers and other substrates. The highest federal accolade for innovative companies in Austria was presented by Vice Chancellor and Federal Minister Dr. Reinhold Mitterlehner on March 28 at an awards ceremony at the Hall of Sciences in Vienna.

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EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging  

2017_03_IQAlignerNT_thumbnailST. FLORIAN, Austria, March 8, 2017-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the IQ Aligner NT-its latest and most advanced automated mask alignment system for high-volume advanced packaging applications. Featuring high-intensity and high-uniformity exposure optics, new wafer handling hardware, full 200-mm and 300-mm wafer coverage that enables global multi-point alignment, and optimized tool software, the new IQ Aligner NT provides a 2X increase in throughput and 2X improvement in alignment accuracy over EVG's previous-generation IQ Aligner.

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Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding  

2017_01_imec_thumbnailLeuven (Belgium)-Jan. 19, 2017- At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), the world-leading research and innovation hub for nano-electronics and digital technology imec and the leading supplier of wafer-bonding equipment EV Group (EVG) announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. Expanding this collaboration, EVG will become a partner in imec's 3D integration program through a joint development agreement to further improve overlay accuracy in wafer-to-wafer bonding.

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