Press Center

EV Group Honored As Most Innovative Company in Austria  

2017_03_Innovationspreis_ThumbnailST. FLORIAN, Austria, April 4, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received the 2017 Austrian Innovation Award, known as the "Staatspreis Innovation 2017," for the development of EVG's groundbreaking SmartNIL® nanoimprint lithography technology for micro- and nano-structuring of wafers and other substrates. The highest federal accolade for innovative companies in Austria was presented by Vice Chancellor and Federal Minister Dr. Reinhold Mitterlehner on March 28 at an awards ceremony at the Hall of Sciences in Vienna.

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EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging  

2017_03_IQAlignerNT_thumbnailST. FLORIAN, Austria, March 8, 2017-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the IQ Aligner NT-its latest and most advanced automated mask alignment system for high-volume advanced packaging applications. Featuring high-intensity and high-uniformity exposure optics, new wafer handling hardware, full 200-mm and 300-mm wafer coverage that enables global multi-point alignment, and optimized tool software, the new IQ Aligner NT provides a 2X increase in throughput and 2X improvement in alignment accuracy over EVG's previous-generation IQ Aligner.

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Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding  

2017_01_imec_thumbnailLeuven (Belgium)-Jan. 19, 2017- At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), the world-leading research and innovation hub for nano-electronics and digital technology imec and the leading supplier of wafer-bonding equipment EV Group (EVG) announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. Expanding this collaboration, EVG will become a partner in imec's 3D integration program through a joint development agreement to further improve overlay accuracy in wafer-to-wafer bonding.

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