Press Center

EV Group Unveils Next-Generation Fusion Wafer Bonder for "More Moore" Scaling and Front-End Processing  

2018_12_BONDSCALE_thumbnailSt. Florian, Austria, December 3, 2018-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets,today introduced the all new BONDSCALE™ automated production fusion bonding system. BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use layer-transfer processing, such as monolithic 3D (M3D).

more...
 

IHP – Innovations for High Performance Microelectronics cooperates with EV Group on low-temperature covalent wafer bonding technologies for developing next-gen communication devices  

2018_11_EVG_ComBond_1_thumbSt. Florian, Austria / Frankfurt (Oder), Germany, November 12, 2018: EV Group (EVG) today announced that IHP - Innovations for High Performance Microelectronics (IHP), a German research institute for silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication, has purchased an EVG® ComBond® automated high-vacuum wafer bonding system for use in developing next-generation wireless and broadband communication devices.

more...
 

EV Group partners with Plessey to drive GaN-on-Silicon monolithic microLED technology for AR applications  

2018_11_Plessey_GEMINI_thumbnail2Plymouth, England - 12 November 2018: Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology for next-generation AR applications.

more...