DI Erich Thallner Strasse 1
4782 St. Florian am Inn
Austria
Press Center
24.06.2019
EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria
11.06.2019
EV Group Brings Nanoimprint Lithography to Full-Scale Production with the First Fully Integrated 300-mm Nanoimprint Lithography Track System
21.05.2019
EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019
19.03.2019
EV Group Partners with NSI to Enable First Wafer-Level Heterogeneous Integration of GaAs on Silicon for RF Front-End Module Manufacturing
13.03.2019
EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing
02.12.2018
EV Group Unveils Next-Generation Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing
11.11.2018
IHP – Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temperature Covalent Wafer Bonding Technologies for Developing Next-Gen Communication Devices
11.11.2018