DI Erich Thallner Strasse 1
4782 St. Florian am Inn
Austria
ST. FLORIAN, Austria, September 2, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced the promotion of Cindy (Yu-Ying) Lee to general manager of EV Group Taiwan Ltd., EVG’s fully owned subsidiary in Taiwan. Lee assumes this leadership role immediately, succeeding Tsemin Tsai, who will continue to serve as president of EVG-Jointech Corp., the joint venture between EVG and Jointech responsible for EVG’s sales and marketing activities in Taiwan.
As general manager, Lee will play a critical role in leading EVG’s operations in Taiwan. She previously served as technology development and IP manager at EVG Taiwan for nine years, and before that held engineering roles at EVG and Qualcomm. She holds a master’s degree in materials science and engineering from National Taiwan University.
Taiwan’s strategic importance as an epicenter of semiconductor manufacturing and advanced packaging has led EVG to significantly expand its presence in the region to better support local customers and partners. Founded in 2013, EVG Taiwan plays a key role in the company’s global customer support network, strengthening local customer support in the areas of equipment lifecycle, preventative tool maintenance, process development, operator training, and spare parts management.
“Cindy Lee has made immeasurable contributions to EV Group’s Taiwan operations through her years of service to our organization, and we are pleased to announce this much-deserved promotion. Under her leadership, EVG Taiwan is well-positioned to continue its mission of delivering best-in-class support to our local customers as they navigate the next era of semiconductor innovation,” stated Hermann Waltl, executive sales and customer support director at EV Group.
EV Group (EVG) provides innovative process solutions and expertise for implementing cutting-edge semiconductor designs and 3D integration of microchips. The company’s mission and vision — to be first in new technologies and to support the most advanced applications in micro- and nanotechnology — enable customers to successfully market their new product ideas. EVG’s products, designed for high-volume production, include wafer bonding, lithography, thin-wafer processing, and metrology systems. These solutions drive further advancements in semiconductor frontend scaling, 3D integration, advanced packaging, and other electronics and photonics applications.
More information at www.EVGroup.com.
Clemens Schütte
Director, Marketing and Communications
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com
David Moreno
Principal
Open Sky Communications
Tel: +1.415.519.3915
E-mail: dmoreno@openskypr.com
DI Erich Thallner Strasse 1
4782 St. Florian am Inn
Austria