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ST. FLORIAN, Austria, May 25, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced lithography solutions will be highlighted in several papers being presented at the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), to be held May 31-June 3 in San Diego, Calif.
EVG’s wafer bonding, lithography and metrology solutions enable the development and high-volume manufacturing of technology innovations in advanced packaging—including backside illuminated CMOS image sensors and other 3D-IC stacked devices—as well as in MEMS and compound semiconductors, such as SiPh and engineered substrates. Recent breakthroughs in wafer-to-wafer and die-to-wafer hybrid bonding to address the needs for 3D device integration, wafer bond alignment technology to address future 3D-IC packaging requirements, fusion bonding for front-end-of-line layer transfer processes, maskless exposure for FOWLP, and nanoimprint lithography (NIL) to support wafer-level optics (WLO) manufacturing, are just a few examples of EVG’s technology leadership in heterogeneous integration and wafer-level packaging.
In addition, EVG engages with companies and research groups across the technology supply chain to develop high-volume manufacturing solutions that drive new innovations in semiconductors, sensors and photonics for a wide variety of automotive, industrial and home entertainment applications.
ECTC attendees interested in learning more about EVG and its suite of wafer bonding, lithography and metrology solutions for heterogeneous integration and wafer-level packaging are invited to visit EVG at booth #602 on May 31-June 3 at The Sheraton San Diego Hotel and Marina in San Diego.
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.
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