DI Erich Thallner Strasse 1
4782 St. Florian am Inn
Austria
Press Center
08.06.2021
EV Group Unlocks Agile and Efficient Production Scaling with Next-generation Step-and-Repeat Nanoimprint Lithography System
12.05.2021
EV Group Earns Impressive Ninth Consecutive Triple Crown Win in VLSIresearch 2021 Customer Satisfaction Survey
19.04.2021
YES Joins Forces with EV Group
29.01.2021
ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration
19.01.2021
EV Group Establishes State-of-the-Art Customer Training Facility at Corporate Headquarters
10.12.2020
EV Group Unveils Hybrid Die-to-Wafer Bonding Activation Solution to Speed Up Deployment of 3D Heterogeneous Integration
19.10.2020
EV Group Addresses Key Process Gap in Heterogeneous Integration with Collective Die-to-Wafer Hybrid and Fusion Bonding Demonstration
14.10.2020