DI Erich Thallner Strasse 1
4782 St. Florian am Inn
ST. FLORIAN, Austria, May 21, 2019 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced wafer bonding solutions will be highlighted in several papers being presented at the 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), to be held May 28-31 in Las Vegas.
EVG’s wafer bonding, lithography and metrology solutions enable the development and high-volume manufacturing of technology innovations in advanced packaging—including backside illuminated CMOS image sensors and other 3D-IC stacked devices—as well as in MEMS and compound semiconductors, such as silicon photonics and engineered substrates. Recent breakthroughs in laser debonding for Fan-out Wafer Level Packaging (FO-WLP), wafer bond alignment technology to address future 3D-IC packaging requirements, fusion bonding for front-end-of-line layer transfer processes, and nanoimprint lithography (NIL) to support wafer-level optics (WLO) manufacturing, are just a few examples of EVG’s technology leadership in heterogeneous integration and wafer-level packaging.
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.
Director, Marketing and Communications
Tel: +43 7712 5311 0
Open Sky Communications
ECTC attendees interested in learning more about EVG and its suite of wafer bonding, lithography and metrology solutions for heterogeneous integration and wafer-level packaging are invited to visit EVG at booth #409 on May 28-31 at The Cosmopolitan of Las Vegas.