DI Erich Thallner Strasse 1
4782 St. Florian am Inn
ST. FLORIAN, Austria, May 16, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration enabled by its advanced wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding, lithography, and revolutionary infrared (IR) laser cleave solutions will be highlighted in multiple papers being presented at the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), to be held May 30-June 2 in Orlando, Fla.
Special Panel Session
Dr. Thomas Uhrmann of EVG will also participate in a special session panel, “Copper Hybrid Bond Interconnections for Chip-to-Wafer Applications,” moderated by Jan Vardaman of TechSearch International, on Tue., May 30, 10:30am-12:00pm.
EVG Heterogeneous Integration Solution
EVG’s wafer bonding, lithography and metrology solutions enable the development and high-volume manufacturing of technology innovations in advanced packaging—including backside illuminated CMOS image sensors and other 3D-IC stacked devices—as well as in MEMS and compound semiconductors. Recent breakthroughs in hybrid bonding to address the needs for 3D device integration, wafer bond alignment technology to address future 3D-IC packaging requirements, IR laser release technology to eliminate glass substrates for advanced packaging and enable thin-layer 3D stacking, maskless exposure for Fan-out wafer level packaging (FOWLP), and nanoimprint lithography (NIL) to support wafer-level optics (WLO) manufacturing, are just a few examples of EVG’s technology leadership in heterogeneous integration and wafer-level packaging.
EVG also engages with companies and research groups across the technology supply chain to develop high-volume manufacturing solutions that drive new innovations in semiconductors, sensors and photonics for a wide variety of automotive, medical, industrial and home entertainment applications.
See EVG at ECT
ECTC attendees interested in learning more about EVG and its suite of wafer bonding, lithography and metrology solutions for heterogeneous integration are invited to visit EVG at Booth 330 on May 30-June 2 at The Grande Lakes Resort in Orlando, Fla.
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.
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