EV GroupCompanyAbout EVG

About EVG

Short Profile

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.
With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in the U.S. and Japan, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base – from the initial development through to the final integration at the customer’s site.
Founded in 1980, EVG services and supports an elaborate network of global customers and partners all over the world, with more than 900 employees worldwide and fully-owned subsidiaries in the U.S., Japan, South Korea, China and Taiwan.

Vision/Mission

invent – innovate – implement

Our Triple-i philosophy is reflected in the enthusiasm for technology, innovative strength and internationality of the entire company. Our vison of “being the first in exploring new techniques and serving next-generation applications of micro- and nanofabrication technologies” enables our customers to successfully commercialize their new product ideas.

Our Story

Impact

Aided by our manufacturing technology, all kinds of microchips as well as other electronic, micro-mechanical and optical components with microscopically small structures are created on thin discs, known as “wafers”, or other substrates, which are made of silicon, glass or similar materials.
At the manufacturing sites of our global customers, EVG’s precision mechanical engineering systems are used to produce key components such as camera sensor chips, position- and motion-sensors, microphones and displays for smartphones, virtual reality glasses and gaming consoles. In addition, our technology enables airbag sensors and central components for advanced driver assistance systems in modern cars, as well as pioneering bio-medical products such as micro-fluidic chips that facilitate blood analysis on-site at a medical office or lab, or DNA analysis for early detection screening.

History

Since our founding by DI Erich and Aya Maria Thallner in 1980, a mix of bold, innovative thinking and a commitment to developing leading-edge, quality manufacturing systems has paved the way for EVG’s global success as a leading supplier of equipment and process solutions for the semiconductor industry and related markets.

EVG continues to shape the industry, working with nearly every major semiconductor and MEMS manufacturer today. We developed the world’s first double-side mask aligner with bottom-side microscopes, which enabled the widespread commercialization of MEMS products, in 1985. The process separation between wafer alignment and wafer bonding, developed in 1990, revolutionized wafer bonding technology and has since become an industry standard. The first production wafer bonding system for volume MEMS manufacturing, introduced in 1992, laid the foundation for EVG’s market leadership in wafer bonding systems. Subsequent innovations included the patented SmartView® face-to-face wafer alignment technology for wafer-level packaging and 3D interconnect introduced in 1999, the industry’s first integrated production wafer bonding system launched under the name GEMINI® in 2000, temporary wafer bonding and debonding technology (developed as early as 2001) and the world's first fully automated production wafer bonding system for 300 mm wafers launched in 2007. The groundbreaking ComBond® high-vacuum cluster tool, introduced in October 2014, enabled electrically conductive and oxide-free covalent bonds at room temperature for engineered substrate and power device production applications and paved the way for completely new and innovative MEMS developments. With the HERCULES® NIL, launched in July 2015, EVG ramped nanoimprint lithography (NIL) into high-volume manufacturing. In December 2018, EVG unveiled BONDSCALETM, the company’s next-generation fusion wafer bonder for "More Moore" scaling and front-end processing to address future logic transistor scaling and 3D integration challenges outlined in the IRDS Roadmap.

Awards and Recognitions

A selection

Global Technology Award – Best Product – Europe for EVG® MLE™ Maskless Exposure Technology - 2019
Global Technology Award – Best Product – Europe for EVG® MLE™ Maskless Exposure Technology - 2019
Austrian Innovation Award 2004 & 2017
EVG earns triple crown for 7th year in a row
EVG achieves its highest 10 BEST rating ever
Listed among the “THE BEST” Suppliers of Fab Equipment for the 17th consecutive year
Analog Devices Supplier Excellence Award 2015 & 2016
3D InCites Award 2011 & 2013
A*STAR Institute of Materials Research and Engineering Award
2010 Nanoimprint Technology Product Innovation Award

Corporate Social Responsibility

EV Group (EVG) is a responsible global organization committed to safeguarding the welfare of our society and the environment in which we work. In order to conduct our operations in an environmentally and socially responsible manner, and create environmentally and socially friendly practices, EVG decided in 2009 to integrate an Environmental Management System based on the ISO 14001 standard into our existing Quality Management System. ISO 14001 certification was achieved in May 2010.

Through careful handling of resources and energy, and by reducing solid waste, emissions and waste water, we continuously improve our environmental performance.
Since introducing its environmental management system, EVG has not only taken on an active role in environmental protection, but also has simultaneously reduced its operating costs. This shows that environmental protection and financials, rather than being contrary goals, can complete each other.

As part of our corporate social responsibility, we comply with and also demand that our suppliers comply with all relevant legal requirements and regulations regarding environmental protection, occupational health and safety, accident prevention, transport and equipment safety. We have committed ourselves to the Responsible Business Alliance (RBA) Code of Conduct (formerly known as “EICC Code of Conduct”), support the 2010 Dodd-Frank Act (“Conflict Minerals”), and are dedicated to prohibiting the receipt of goods and/or services from suppliers known to have violated occupational health and safety provisions and - in particular - human rights, including child labor, slavery, forced labor and conflict minerals, to name a few examples.

We ensure equality to all employees, irrespective of their gender, race, ethnic origin, disability, age, nationality, national origin, sexuality, religion or belief, marital status and social class. No form of discrimination, intimidation, bullying or harassment will be tolerated. All employees, whether part time, full time or temporary, are treated fairly and equally, with dignity and respect, valuing the diversity of all. This policy applies to all aspects of employment from recruitment, training, and career development to promotion and redundancy. Selection for employment, promotion, training or any other benefit will be on the basis of aptitude and ability.

ISO 9001:2015

In 2002 EVG started implementing a QM-system according to "ISO 9001". The first certification was achieved in 2004. Since this time the certificate has been successfully extended or renewed by external audits on an annual basis.

The scope of the Quality Management System and the Environmental Management System covers the products and services of all EV Group organizations, which are located in St. Florian am Inn, Austria.

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