EVG®501 Wafer Bonding System

Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

 

The EVG501 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 200 mm wafers. The new tool supports a variety of bonding
processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide
removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than five
minutes, making it ideal for universities and R&D as well as small-volume production applications.


Features

  • Optimum total cost of ownership (TCO) for R&D and pilot line production
  • Bonds up to 10 kN force at temperatures up to 450°C
  • Real and low-force wafer wedge compensation system for highest yield
  • Large process window: temperature uniformity <+/- 1% and pressure uniformity <+/- 5%
  • Fully recipe compatible to EVG production bonding systems (EVG520IS, EVG560, GEMINI)
  • High-vacuum capable bond chamber (down to 10-5 mbar with turbo molecular pump)
  • Open chamber design for fast conversion and maintenance
  • Windows based control software and operation interface
  • Smallest footprint for a 200 mm bonding system: 0.88 m2