For temporary bonding of a substrate on a rigid carrier.
EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System
EVG集团向中国领先的晶圆代工厂交付300MM晶圆键合系统用于3D IC及高级芯片封装批量生产
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EV Group Unveils Next-Generation Temporary Bonding and Debonding Platform
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