For temporary bonding of a substrate on a rigid carrier.
Customers Have Voted EV Group as one of the World's Best Suppliers in the VLSIresearch 2016 Customer Satisfaction Survey
EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Bonder for 3D Chip Stacking Production Applications
EV Group Unveils Next-Generation Temporary Bonding and Debonding Platform
EV Group Corporate Video