EVG®850TB Automated Temporary Bonding System

For temporary bonding of a substrate on a rigid carrier.

Max. wafer size: 200 mm or 300 mm, different substrate/carrier combinations
Loading of chamber: 5 axis robot
Configuration: Coat, bake and bond modules
Options:
Inline metrology module - void detection, layer thickness and TTV measurement
High viscosity adhesive dispense system
Features:
ZoneBOND^TM carrier preparation
Contact force: 10 kN
Temperature: 250°C (350°C optional)
Vacuum: 0.1 mbar

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