For temporary bonding of a substrate on a rigid carrier.
EVG and Dynaloy Jointly Develop Single-Wafer Cleaning Solution
Fraunhofer ISE Teams up with EVG to Enable Direct Semiconductor Wafer Bonds
Photonics Festival 2013
intersolar North America 2013
EV Group Unveils Next-Generation Temporary Bonding and Debonding Platform
EV Group Corporate Video
3D InCites reports on EVG Headquarters expansion and technology developments