EVG®850TB Automated Temporary Bonding System

For temporary bonding of a substrate on a rigid carrier.

 

  • Max. wafer size: 200 mm or 300 mm, different substrate/carrier combinations
  • Loading of chamber: 5 axis robot
  • Configuration: Coat, bake and bond modules
  • Options:
    Inline metrology module - void detection, layer thickness and TTV measurement
    High viscosity adhesive dispense system
  • Features:
    ZoneBONDTM carrier preparation
    Contact force: 10 kN
    Temperature: 250°C (350°C optional)
    Vacuum: 0.1 mbar