EVG®805 Semi-Automated Debonding System

For thin wafer debonding. 

 

The EVG805 is a semi-automated system for debonding thin wafers from silicon, sapphire, or other material carriers. Dependent from the intermediate material, various debond approaches are possible. As for waxes and thermo-plast materials a thermal-activated, mechanical slide-off is utilized. For thermal release tapes a lift-off debond is utilized. In case of material requiring UV-activation, UV-exposure is possible as well. The thin wafer will be unloaded on a single substrate carrier for save and reliable transport.
The EVG805 semi-automated system is compatible with EVG’s new EZD® module enabling wafer debonding at room temperature. The thin wafer will be supported all time by a dicing tape/frame mounted already prior loading.


Features

  • Semi-automated processing
  • Recipe controlled
  • Real time monitoring and recording of all process parameters
  • Various chuck designs to support wafer/substrates and carriers up to 300 mm
  • Single thin wafer carrier for unloading of device substrate
  • Various debond methods available: slide-off, lift-off, edge zone debond (EZD® ), UV assisted debonding