Wafer level packaging employs specific alignment and wafer bonding
techniques as an enabling solution for stacking of wafers and
three-dimensional integration of devices.
Visit us and our presentation about "Advanced wafer bonding techniques for photonic integration" at PIC International 2016.
Visit us at SEMI ISS Europe 2016.
Visit us at booth #3519 at SEMICON China 2016 and visit our presentation "Wafer-Level Bonding for High-Vacuum MEMS Manufacturing" CSTIC.
Visit us at SEMICON Southeast Asia 2016.
Visit our booth # 7 at ESTC 2016.
EV Group Joins IRT Nanoelec 3D Integration Program
Korean National Nanofab Center Installs High-Vacuum Wafer Bonder from EV Group for Advanced MEMS Research and Foundry Services
CS International 2016
PIC International 2016
EV Group and Fraunhofer IZM-ASSID Establish JDA for High-Volume 3D Integration Applications
EV Group Corporate Video