先进封装,三维层叠互联

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 
imaps_4tierIMAPS Device Packaging 2017
March 07 - 09, 2017, Fountain Hills, Arizona, USA
Visit our booth at the IMAPS Device Packaging 2017.


semiconchina
SEMICON China 2017
March 14 - 16, 2017, Shanghai New International Expo Centre, China
Visit our booth # 4663 in Hall W4 at SEMICON China 2017.

theconfab-logo976x477ConFab 2017
May 14 - 17, 2017, Hotel del Coronado, San Diego, CA
Visit EVG at The ConFab 2017.

ECTC2017ECTC 2017
May 30 - June 02, 2017, Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, FL
Visit our booth #405 at ECTC 2017.

semiconwestSEMICON West 2017
July 11 - 13, 2017, Moscone Center, San Francisco, CA
Visit our booth at SEMICON West 2017.

semiconeuropa_logoSEMICON Europa 2017
November 14 - 17, 2017, Messe München, Munich, Germany
Visit us at our booth #B1-1424 at SEMICON Europa 2017.