先进封装,三维层叠互联

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 


SEMI3DTSVSummit15

SEMI European 3D TSV Summit 2015
January 19 - 21, 2015, Grenoble, France
Visit us at booth # 15 at the SEMI European 3D TSV Summit 2015.


SCKorea_2015_logo_0
SEMICON Korea 2015
February 04 - 06, 2015, COEX, Seoul, Korea
Visit us at our booth # 1352 at SEMICON Korea 2015.

SEMICON China 2015

SEMICON China 2015
March 17 - 19, 2015, Shanghai New International Expo Centre

Visit our booth # 3519 in Hall W3 at SEMICON China 2015.