Wafer level packaging employs specific alignment and wafer bonding
techniques as an enabling solution for stacking of wafers and
three-dimensional integration of devices.
Visit us at ICEPT 2016.
Visit our booth # 606 in hall 4F and our presentations at SEMICON Taiwan 2016.
Visit our booth # 7 at ESTC 2016.
Visit us at our booth #950 at SEMICON EUROPA 2016.
EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing
EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing
SEMICON Taiwan 2016
EV Group and Fraunhofer IZM-ASSID Establish JDA for High-Volume 3D Integration Applications
EV Group Corporate Video