先进封装,三维层叠互联

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 

SPCC 2014 

SEMATECH Surface Preparation and Cleaning Conference 2014
Apr 22 - 24, 2014, Austin, Texas

Visit our presentation about "A new Single Wafer Cleaning Technology for Advanced Packaging Applications" at the SEMATECH Surface Preparation and Cleaning Conference 2014.


 

SEMICON Singapore 

SEMICON Singapore 2014
April 23 - 25, 2014, Marina Bay Sands Expo, Singapore

Visit our presentations at SEMICON Singapore 2014:

Thursday, 24 April 2014: 
TechARENA Stage, 14:30: "Silicon Photonics - Key Process for High Volume Manufacturing"
2.5D/3D-IC Forum, 16:50: "Enabling Technologies for 2.5D Interposer Manufacturing"

Friday, 25 April 2014:
MEMS Technology Forum, 12:20: "Wafer level Packaging - an Enabling Technology for Inertial MEMS"


CS MANTECH 

CS MANTECH 2014
May 19 - 22, 2014, Denver, Colorado, USA

Visit our presentation about "Advanced Bonding Techniques for Photonic Integrated Circuits" at CS MANTECH 2014.


MiNaPAD 

MiNaPAD 2014
May 20 - 22, 2014, MINATEC, Grenoble, France

Visit our presentation about "Mechanical coupling of a temporary bonding" at MiNaPAD 2014.


ECTC2014 

ECTC 2014
May 27 - 30, 2014, Lake Buena Vista, FL

Visit our booth #419 and presentation "Versatile Thin Wafer Stacking Technology for Monolithic Integration of Temporary Bonded Thin Wafers" at ECTC 2014.


  SEMICON West 2014

SEMICON West 2014
July 08 - 10, 2014, Moscone Center, San Francisco

Visit us at our booth # 817 at SEMICON West 2014.


SEMICON Europa 

SEMICON Europa 2014
October 07 - 09, 2014, Alpexpo Grenoble, France

Visit us at our booth # 918 at SEMICON Europa 2014.