先进封装,三维层叠互联

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 

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ICEP-IAAC 2015
April 14 - 17, 2015, Kyoto Terrsa, Kyoto, Japan

Visit our presentation about "Low/Room Temperature Wafer Bonding Technologies for Three-Dimensional Integration" at ICEP-IAAC 2015.

 


Header_SEMI Packaging Tech SeminarSEMI Packaging Tech Seminar 2015
June 18, 2015, Vila do Conde, Portugal

Visit us at the SEMI Packaging Tech Seminar 2015.

 


semicontwSEMICON Taiwan 2015
September 02 - 04, 2015, TWTC, Taipei, Taiwan

Visit us at booth # 706 at SEMICON Taiwan 2015.

 


semiconeuropaSEMICON Europa 2015
October 06 - 08, 2015, Dresden, Germany

Visit us at booth # 1324 at SEMICON Europa 2015