先进封装,三维层叠互联

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 
SCW15_Vrt_rgb_msSEMICON West 2015
July 14 - 16, 2015, Moscone Center, San Francisco

Meet us at booth # 817 at SEMICON West 2015

Visit our presentation "Trends in device encapsulation and wafer bonding" in the session "What's Next for MEMS?" at the TechXPOT South Hall on July 14, 2015.

 


iceptICEPT 2015
August 11 - 14, 2015, Changsha, China

Visit us at ICEPT 2015.

 


semicontwSEMICON Taiwan 2015
September 02 - 04, 2015, TWTC, Taipei, Taiwan

Visit us at booth # 706 at SEMICON Taiwan 2015.

 


semiconeuropaSEMICON Europa 2015
October 06 - 08, 2015, Dresden, Germany

Visit us at booth # 1324 at SEMICON Europa 2015