先进封装,三维层叠互联

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 

  semicontaiwan

SEMICON Taiwan 2014
September 03 - 05, 2014, TWTC Nangang Exhibition Hall, Taiwan

Visit our booth # 316 and our presentations at the MEMS Forum, the SiP Global Summit 2014 - 3D IC Technology and the TechXPOT at SEMICON Taiwan 2014.


SEMICON Europa 

SEMICON Europa 2014
October 07 - 09, 2014, Alpexpo Grenoble, France

Visit our booth # 918 and our presentations at SEMICON Europa 2014.