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EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging  

2017_03_IQAlignerNT_thumbnailST. FLORIAN, Austria, March 8, 2017-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the IQ Aligner NT-its latest and most advanced automated mask alignment system for high-volume advanced packaging applications. Featuring high-intensity and high-uniformity exposure optics, new wafer handling hardware, full 200-mm and 300-mm wafer coverage that enables global multi-point alignment, and optimized tool software, the new IQ Aligner NT provides a 2X increase in throughput and 2X improvement in alignment accuracy over EVG's previous-generation IQ Aligner.


Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding  

2017_01_imec_thumbnailLeuven (Belgium)-Jan. 19, 2017- At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), the world-leading research and innovation hub for nano-electronics and digital technology imec and the leading supplier of wafer-bonding equipment EV Group (EVG) announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. Expanding this collaboration, EVG will become a partner in imec's 3D integration program through a joint development agreement to further improve overlay accuracy in wafer-to-wafer bonding.