Press Center

AngeLab project receives Innovation Award at the European Nanoelectronics Forum  

2016_11_AngeLab_NEF_2016_award_thumbROME, November 23, 2016. The AngeLab project has been acknowledged by the European Commission as one of the most innovative Horizon2020/FP7 projects in the area of "Micro/Nano Electronics", "Smart System Integration", or "Thin Organic Large Area Electronics". It received an Innovation Awards today in Rome in the framework European Nanoelectronics Forum.

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30.2 Percent Efficiency - New Record for Silicon-Based Multi-Junction Solar Cell  

Wafer-bonded multi-junction solar cell_ThumbnailFREIBURG, Germany and ST. FLORIAN, Austria, November 9, 2016 - Researchers at the Fraunhofer Institute for Solar Energy Systems ISE together with the Austrian company EV Group (EVG) have successfully manufactured a silicon-based multi-junction solar cell with two contacts and an efficiency exceeding the theoretical limit of silicon solar cells.

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EV Group Extends Volume Manufacturing Expertise to Biotechnology and Medical Device Applications  

2016_09_Biotech_thumbnailST. FLORIAN, Austria, September 26, 2016 - EV Group (EVG) today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market. EVG products supporting this market include the company's substrate bonding, hot-embossing, micro contact printing and UV-based nanoimprint lithography (NIL) systems.

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Leti Orders HERCULES NIL System from EV Group for Joint Nanoimprint Lithography Program  

2016_09_Leti_ThumbnailST. FLORIAN, Austria and GRENOBLE, France, September 21, 2016 - EV Group (EVG) and Leti announced today that Leti has ordered a HERCULES NIL track system from EV Group. The HERCULES NIL system will be installed in Leti's cleanroom facility in Grenoble, where it will augment the process-development and demonstration capabilities available to participants in the collaborative EVG-Leti INSPIRE program.

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EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing  

EVG50 Automated Metrology System_ThumbnailST. FLORIAN, Austria, July 11, 2016 - EV Group (EVG) today introduced the EVG®50 automated metrology system. Designed to support the increasingly stringent manufacturing requirements for advanced packaging, MEMS and photonics applications, the EVG50 performs high-resolution non-destructive multi-layer thickness and topography measurement, as well as void detection, in bonded wafer stacks and in photoresists used in optical lithography.

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EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing  

EVG ComBond Automated High-Vacuum Wafer Bonding Platform_thumbnailST. FLORIAN, Austria, July 6, 2016 - EV Group (EVG) today introduced new capabilities on the EVG ComBond® automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices. These capabilities include a new vacuum bond alignment module and a new bake module.

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EV Group Scores Fourth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey  

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ST. FLORIAN, Austria, June 21, 2016 - EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey. For 2016, EVG was ranked as one of the 10 BEST Focused Chip Making Equipment Suppliers, having steadily increased its overall ratings since 2013. EVG was also cited as one of THE BEST Suppliers of Fab Equipment and received a RANKED 1st award in Specialty Fab Equipment.


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EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Bonder for 3D Chip Stacking Production Applications  

Fusion_Bonding_Leadership_2ST. FLORIAN, Austria, May 10, 2016 - EV Group (EVG) today announced that it has received multiple orders for its GEMINI® FB XT automated fusion wafer bonders from multiple leading device manufacturers.These latest orders will support several leading-edge HVM applications, including 3D stacked image sensors, memory stacking, and die partitioning for next-generation 3D system-on-chip (SoC) devices.

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EV Group Receives Prestigious Supplier Excellence Award from Analog Devices  

ADI_Award_1_thumbnailHONG KONG / ST. FLORIAN, Austria, April 5, 2016 - EV Group (EVG) has received a 2015 Supplier Excellence Award from Analog Devices Inc. (ADI) in the category of "Special Achievement". This prestigious award is presented annually to outstanding suppliers that play a key role in ADI's success and that work with ADI in the ongoing development and improvement of products and manufacturing processes.

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EV Group Scales Up Nanoimprint Lithography for Display Manufacturing  

EVG7200_LA_cleanroom_thumbnailST. FLORIAN, Austria, March 14, 2016 - EV Group (EVG) today introduced the EVG®7200 LA SmartNIL™ system for display manufacturing and other applications that require large-area substrates. Leveraging EVG's proprietary SmartNIL technology, the automated UV nanoimprint lithography (UV-NIL) system enables cost-efficient nano-patterning in high-volume manufacturing (HVM) applications.

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JOANNEUM RESEARCH and EV Group Jointly Develop Large-Area Nanoimprint Lithography Solution for Microfluidics and Photonics Applications  

EVG_JOANNEUM_Thumbnail ST. FLORIAN / GRAZ, Austria, March 10, 2016 - EV Group (EVG), and JOANNEUM RESEARCH (JR) today announced that they are collaborating on a joint-solution for research and development activities in large-area nanoimprinting leveraging the EVG®770 automated UV-nanoimprint lithography (NIL) step-and-repeat system. Specifically, the two organizations have adapted the EVG770 with new capabilities to accommodate foil substrates that will enable the EVG770 to be used at JR to manufacture flexible master templates applied in roll-to-roll NIL processing for photonics, functional surfaces and microfluidic device production.

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2015 European SEMI Award Honors Paul Lindner  

SEMI_Europe_Award_thumbnailNICE, France - 8 March 2016 - Paul Lindner, executive technology director at EV Group, is the recipient of the 2015 European SEMI Award.  Since 1989, the European SEMI Award has been presented to the person or team that made significant contributions to the European semiconductor and related industries. This award, an industry honor for Lindner, was presented at the SEMI Industry Strategy Symposium Europe 2016 conference held in Nice on 6–8 March.

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EV Group Brings 300-mm Wafer Bonding to MEMS Manufacturing with GEMINI® Automated Wafer Bonder  

EVG_GEMINI300_MEMS_ThumbnailST. FLORIAN, Austria, March 7, 2016 - EV Group (EVG) today announced that its EVG GEMINI® 300-mm automated wafer bonding system is ready for implementation into MEMS high-volume manufacturing (HVM). This marks an important milestone for the MEMS industry, which until now has utilized smaller 200-mm wafer substrates for MEMS HVM.

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FP7-Project "MSP - Multi Sensor Platform for Smart Building Management" announces an extended Multi-Project-Wafer service with sensor functions - a big step forward to a European ecosystem for integrated multi sensor systems  

2016_02_MSP_ThumbnailPRESS RELEASE, February 26, 2016 - The € 18 million FP7 project "MSP - Multi Sensor Platform for Smart Building Management" project has achieved an important milestone on creating a European ecosystem for integrated multi sensor systems. An extended Multi-Project-Wafer (MPW) service providing sensing functions and key features for 3D-integration of sensor devices is now available for customers.

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WIKA Group Adopts HERCULES® Lithography Track System From EV GROUP for Pressure Sensor Manufacturing  

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ST. FLORIAN, Austria, February 17, 2016 - EV Group (EVG) today announced that WIKA Group, a global leader in pressure, temperature and level measurement technology, has put an EVG HERCULES® lithography track system into production for manufacturing pressure sensor devices. The HERCULES system has shortly been installed and is in operation at WIKA's fabrication headquarters in Klingenberg, Germany.


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EV Group Joins IRT Nanoelec 3D Integration Program  

2016_02_IRT3D_TeaserST. FLORIAN, Austria, February 5, 2016 -  EV Group (EVG) today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies. SET also joined recently the consortium.

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Korean National Nanofab Center Installs High-Vacuum Wafer Bonder from EV Group for Advanced MEMS Research and Foundry Services  

Thumbnail_EVG520IS_NNFCST. FLORIAN, Austria, January 26, 2016 - EV Group (EVG) today announced that it has supplied an EVG520IS semi-automated wafer bonding system with high-vacuum capability to the National Nanofab Center (NNFC), based in Daejeon, Korea. The vacuum capability of the EVG system (up to 5x10-6 mbar) makes it ideally suited for MEMS applications that require a high-vacuum environment be maintained in the cavity after bonding, such as gyroscopes and micro-bolometers.

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EV Group organizes More-than-Moore Technology Seminar in Fremont, California  

Teaser Tech DayTEMPE, Arizona, January 19, 2016 - EV Group (EVG) will host the next event in its EVG Technology Day series in Fremont, Calif., on Wednesday, February 17.

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