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EV Group Next-Gen Nanoimprint Lithography Technology Targets Photonics, LED and Bioengineered Device Production

EVG7200-Automated-UV-Nanoimprint-Lithography-System ST. FLORIAN, Austria, October 21, 2014-EV Group (EVG) today introduced its SmartNIL™ large-area nanoimprint lithography (NIL) process. Available on all EV Group NIL platforms, including mask aligners as well as the industry benchmark EVG®720 and newly available EVG®7200 UV-NIL systems, SmartNIL provides a low-cost, large-area and high-volume-manufacturing solution for a variety of advanced devices.

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EV Group Unveils Room-Temperature Covalent Bonder for Engineered Substrate and Power Device Production Applications

EVG580-ComBond-Automated-High-Vacuum-Wafer-Bonding-System ST. FLORIAN, Austria, October 6, 2014-EV Group (EVG) today introduced the EVG®580 ComBond® - a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature. Built on a modular platform to support high-volume manufacturing (HVM) requirements, the new system is ideally suited for bonding different substrate materials together in order to enable higher-performing devices and new applications.

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EV Group Clears Key Barriers to 3D-IC/TSV High-Volume Manufacturing with Breakthrough Fusion Wafer Bonding Solution

GeminiFB-XT-Automated-Production-Fusion-Bonding-System ST. FLORIAN, Austria, June 30, 2014-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the GEMINI®FB XT-its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs). 

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EV Group Repeats "Triple Crown" Win in 2014 VLSIresearch Customer Satisfaction Survey

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ST. FLORIAN, AUSTRIA, June 18, 2014 - EV Group (EVG) announced that for a second year in a row, it has earned all three coveted awards from VLSIresearch's annual customer satisfaction survey.  EVG has been ranked as one of the 10 BEST Focused Chip Making Equipment Suppliers.  Customers also ranked EV Group as one of the 2014 THE BEST Suppliers of Fab Equipment. Additionally, EVG was distinguished with a 2014 RANKED 1st award in the Other Fab Equipment category.


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EVG Wins TerawaTT Diamond Award at SNEC PV POWER EXPO in Shanghai

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ST. FLORIAN, AUSTRIA, June 4, 2014 - EV Group (EVG) received the prestigious TerawaTT Diamond award during the "Top 10 Highlights Awards" ceremony at the annual SNEC PV POWER EXPO in Shanghai, China. During the world's largest PV show Dr. Antun Peic, Business Development Manager at EVG, was also invited to give a talk about the innovative  "New Anti-Reflective Coating (ARC) Technology for Solar and PV Applications".


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Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding

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RESEARCH TRIANGLE PARK, N.C., May 27, 2014 - Ziptronix Inc.
and EV Group ("EVG") today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix's DBI® Hybrid Bonding technology on an EVG Gemini® FB production fusion bonder and SmartView®NT bond aligner.


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EV Group Receives RANKED 1st Supplier Ranking in VLSIresearch 2014 Customer Satisfaction Survey

2014_05Logo-RANKED_1st  ST. FLORIAN, AUSTRIA, May 23, 2014 - EV Group (EVG) has been recognized once again by customers in VLSIresearch's annual Customer Satisfaction Survey as the preferred supplier of wafer bonders with the receipt of a RANKED 1st Supplier award in the "Other Fab Equipment" category. The RANKED 1st Supplier awards identify the top suppliers in each of the 2014 VLSIresearch Customer Satisfaction Survey categories.

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EV Group Makes Repeat Appearance in THE BEST 2014 Suppliers Award Category in the VLSIresearch 2014 Customer Satisfaction Survey

2014_05Logo-THE_BEST  ST. FLORIAN, AUSTRIA, May 22, 2014 - In its 12th consecutive appearance as one of THE BEST Suppliers in VLSIresearch's annual Customer Satisfaction Survey, EV Group (EVG) was awarded sixth place in the Suppliers of Fab Equipment category. EVG placed higher in ranking compared to last year's survey and was cited by survey respondents in particular for EVG's technical leadership and "trust in supplier".

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EV Group Voted One of the World's 10 BEST SUPPLIERS OF CHIP MAKING EQUIPMENT in the VLSIresearch 2014 Customer Satisfaction Survey

201405Logo-10_BEST  ST. FLORIAN, AUSTRIA, May 21, 2014 - Customers have once again voted EV Group (EVG) one of the "10 BEST Suppliers of 2014" in the latest VLSIresearch Customer Satisfaction Survey in the Focused Supplier category. The market research firm asked worldwide participants to rate equipment suppliers among 15 categories based on three key factors: supplier performance, customer service, and product performance. VLSIresearch received feedback from more than 95% of the chip market to calculate the results of this year's survey.

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EV Group Ships Wafer Bonding and Bond Alignment System to University of Pennsylvania for Advanced Nanotechnology Research

EVG-Bonding-System  ST. FLORIAN, Austria, May 15, 2014-EV Group (EVG) today announced that it has shipped an EVG®510 semi-automated wafer bonding system and an EVG®620 automated bond alignment system to the University of Pennsylvania (Penn).  The systems are installed in the Quattrone Nanofabrication Facility in the Singh Center for Nanotechnology at Penn in Philadelphia, where they are being used for anodic and thermocompression bonding processes in the fabrication of advanced micro- and nano-systems.

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GT Advanced Technologies Announces a Series of Strategic Initiatives to Leverage Its Advances in Hyperion™ Lamina Production Technology

201405GTAT  Merrimack, NH-April 30, 2014-GT Advanced Technologies (NASDAQ: GTAT) today announced several new initiatives aimed at expanding its portfolio of sapphire and silicon carbide (SiC) solutions for next generation consumer and industrial products. The company has entered into a memorandum of understanding ("MOU") with European-based EV Group ("EVG"), a global leader in specialty bonding and material handling equipment, to work together in various collaborative arrangements including jointly developing high volume production processes and equipment necessary to bond the ultra-thin sapphire and SiC lamina, produced by GT's Hyperion™ technology, to engineered substrates such as glass, silicon, and plastics.  

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EV Group wins Compound Semiconductor Manufacturing Award at the CSindustry awards 2014

CS-Awards-Winnerjpg  FRANKFURT/ ST. FLORIAN, March 19, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, received a prestigious Compound Semiconductor Manufacturing Award at CS International 2014 for the company's EVG®PHABLE™ exposure system.

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EV Group Establishes China Headquarters in Shanghai

201403_EVGChina  SEMICON CHINA, Shanghai, March 18, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd., which will serve as regional headquarters for all of EVG's operations in the People's Republic of China.  The new subsidiary, which houses a local service center and spare parts management facility, will further strengthen EVG's presence in the region and support the company's ongoing efforts to improve service and response times to local customers.

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EV Group Boosts 2.5D and 3D-IC/TSV Performance with New NanoSpray™ Application on EVG150XT High-Volume-Manufacturing Photoresist Processing System

EVG2014_03150NXT-Automated-NanoSpray-Coating-System  ST. FLORIAN, Austria, March 12, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.  NanoSpray provides conformal coating of structures that have vertical sidewall angles-such as through-silicon vias (TSVs), through-glass vias and through-substrate vias used for 2.5D interposers and 3D-ICs-with thick polymer liners and photoresists.  This unique capability, which is already available on previous-generation EVG resist processing platforms, has been used in production to reduce mechanical stress and improve electrical performance of these advanced-packaging interconnect structures.

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EV Group and Brisbane Materials Introduce Novel Anti-Reflective Coating Solution for LED Lighting Applications at Strategies in Light

  201402ARCoatingforLED   STRATEGIES IN LIGHT, Santa Clara, Calif., February 25, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, solar and semiconductor markets, and Brisbane Materials Technology (BMT), a specialty materials company, today introduced a new anti-reflective (AR) coating solution based on BMT's innovative XeroCoat® materials, which is designed to substantially increase lumen output of light emitting diode (LED) devices.  The jointly developed manufacturing solution, which leverages a combination of AR coating processing equipment and tunable, durable, inorganic coating material, enables lumen output increases of up to eight percent. 

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EV Group Unveils High-Volume-Manufacturing Photoresist Processing System for Logic and Memory Advanced Packaging Applications

  EVG150XT-HVM-Resist-Processing-System   ST. FLORIAN, Austria, February 11, 2014 - EV Group (EVG) today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing (HVM)-the EVG150XT resist coating and developing system.  Leveraging EVG's XT Frame platform utilized across the spectrum of the company's industry-leading systems, the EVG150XT is optimized for ultra-high throughput and productivity-bringing the company's expertise in lithography processing to HVM environments. 

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EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices

  201401EVG-Fraunhofer-ISIT-IGBT-Wafer   ST. FLORIAN, Austria, January 14, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG®850TB/DB fully automated bonding/debonding equipment solution.  The system has been shipped and installed at Fraunhofer ISIT's facility in Itzehoe, Germany, where it is being used in the development and production of next-generation power devices, including PowerMOS and Insulated Gate Bipolar Transistors (IGBTs).

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