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EV Group Extends Leadership in High-Vacuum Wafer Bonding Technology

201503_EVG580-ComBond ST. FLORIAN, Austria, March 16, 2015-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced two new configurations to its EVG®580 ComBond® series of automated high-vacuum covalent wafer bonding systems. Addressing the needs of universities and R&D institutes, and high-volume manufacturing (HVM) requirements, respectively, both system configurations achieve electrically conductive and oxide-free bonds of materials with different lattice constants and coefficients of thermal expansion at room temperature.


EV Group Establishes Nanoimprint Lithography Competence Center for Photonic Applications

201412EVG-SmartNIL ST. FLORIAN, Austria, December 01, 2014-EV Group (EVG) today announced that it has established the NILPhotonics™ Competence Center, which is designed to assist customers in leveraging EVG's suite of nanoimprint lithography (NIL) solutions to enable new and enhanced products and applications in the field of photonics.