Press Center

EV Group Joins IRT Nanoelec 3D Integration Program  

2016_02_IRT3D_TeaserST. FLORIAN, Austria, February 5, 2016 -  EV Group (EVG) today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies. SET also joined recently the consortium.

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Korean National Nanofab Center Installs High-Vacuum Wafer Bonder from EV Group for Advanced MEMS Research and Foundry Services  

Thumbnail_EVG520IS_NNFCST. FLORIAN, Austria, January 26, 2016 - EV Group (EVG) today announced that it has supplied an EVG520IS semi-automated wafer bonding system with high-vacuum capability to the National Nanofab Center (NNFC), based in Daejeon, Korea. The vacuum capability of the EVG system (up to 5x10-6 mbar) makes it ideally suited for MEMS applications that require a high-vacuum environment be maintained in the cavity after bonding, such as gyroscopes and micro-bolometers.

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EV Group organizes More-than-Moore Technology Seminar in Fremont, California  

Teaser Tech DayTEMPE, Arizona, January 19, 2016 - EV Group (EVG) will host the next event in its EVG Technology Day series in Fremont, Calif., on Wednesday, February 17.

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Growth In Engineered Substrate Market For Power Device And Radio Frequency Applications Driving Demand For EV Group Wafer Bonding Solutions

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ST. FLORIAN , Austria, December 16, 2015 —EV Group (EVG) today announced that the company has seen a significant increase in demand for its wafer bonding solutions for engineered substrates over the past year. This rise in demand is driven in part by the rapid growth in the power electronics and radio frequency (RF) device markets - where engineered substrates offer key performance benefits, such as high carrier mobility and reduced power loss/leakage, due to their unique material properties.


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EVG received a Best in MEMS & Sensors Innovation (MEMsies) Award

Thumbnail_MEMS LogoST. FLORIAN, Austria, November 5, 2015 - During this year's MEMS Executive Congress hosted by the MEMS & Sensors Industry Group (MIG) in Napa Valley on November 4-6, EVG received a Best in MEMS & Sensors Innovation (MEMsies) Award for MEMS/Sensors Supplier of the Year.

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