Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, which are key for 3D IC, power device and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. EVG’s outstanding bonding know-how includes temporary bonding equipment, which has been provided by the company since 2001.
EVG’s open adhesive platform supports all commercially available materials, offering full process integration for temporary bonding and debonding. Adhesives are mainly classified by their debonding mechanism (weakening the adhesive bond between the device and carrier wafer), which is based on laser, mechanical force or temperature. Slide-off and lift-off debonding mark the starting point of temporary bonding at EVG with more than 20 years of experience. More recent developments of mechanical and UV-laser-initiated debonding are combined in EVG’s LowTemp debonding process, where the debond temperature is around room temperature. Especially for recent developments in advanced packaging, LowTemp debonding technologies are essential steps to enable back-side processing of silicon as well as the production of ultra-thin chips and packages for next-generation devices.
Visit our booth #602 and our talk: Optimization of PI & PBO Layers Lithography Process for High Density Fan-Out Wafer Level Packaging & Next Generation Heterogeneous Integration Applications Employing Digitally Driven Maskless Lithography
Visit EVG at booth #8 at the SEMI 3D & Systems Summit 2022!
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