EVG®520 HE

Hot Embossing System

A universal production-proven hot embossing system meeting highest demands

The EVG520 HE Semi-automated Hot Embossing System is designed for high-precision imprinting of thermoplastic substrates. This production-proven system from EVG accepts substrates up to 200 mm in diameter, and is compatible with standard semiconductor manufacturing technologies. The hot embossing system is configured with a universal embossing chamber as well as high-vacuum and high-contact force capabilities, and manages the whole range of polymers suitable for hot embossing. Together with high-aspect-ratio embossing and multiple de-embossing options, many processes for high-quality pattern transfer and nanometer resolution are offered.


  • For hot embossing and nanoimprinting applications of polymer substrates and spin-on polymers
  • Automated embossing process
  • EVG's proprietary separate alignment process for optically aligned embossing and imprinting
  • Pneumatic de-embossing options
  • Software-controlled process execution

Technical Data

Heater size 150 mm 200 mm
Maximum substrate dimension 150 mm 200 mm
Minimum substrate dimension single chips 100 mm
Max Contact Force
10, 20, 60, 100 kN
Max. Temperature
Standard: 350 °C
Optional: 550 °C
Bond chuck system / alignment system
150 mm heater: EVG®610, EVG®620, EVG®6200
200 mm heater: EVG®6200, MBA300, SmartView® NT
Standard: 0.1 mbar
Optional: 0.00001 mbar

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