Automated Resist Processing System

The EVG®150 is a fully- automated resist processing system providing high-throughput performance and supporting wafers up to 300 mm in diameter.

Designed as a fully modular platform, the EVG150 allows automated spray/spin/develop processes and high-throughput performance. The EVG150 guarantees highly uniform coats and improved repeatability. Wafers with high topography can be uniformly coated by EVG’s OmniSpray technology, where traditional spin coating encounters limitations.


  • Wafer sizes up to 300 mm
  • Up to six process modules
  • Customizable number - up to twenty bake/chill/vapor prime stacks
  • Up to four FOUP load ports or cassette loading
  • Available modules include Spin Coat, Spray Coat, NanoCoat™, Develop, Bake/Chill/Vapor/Prime
  • EV Group’s proprietary OmniSpray® ultrasonic atomization technology provides unmatched process results when it comes to conformal coating of extreme topographies
  • Optional NanoSpray™ module achieves conformal coating of 300-micron deep patterns with aspect ratios up to 1:10 and vertical sidewalls
  • Extensive range of supported materials
  • Bake modules for up to 250 °C
  • Megasonic technology for cleaning, sono-chemical processing and developing improves process efficiency and lowers the process time from hours to minutes
  • Sophisticated and field-proven robot handling with dual end-effector capability ensures continuous high throughput
  • Handling of thick or ultra-thin, fragile, bowed or small-diameter wafers 
  • Versatile combinations of multi-functional modules for spin and spray coating, developing, bake and chill provide great opportunities in many fields of application
  • EFEM (Equipment Frontend Module) and optional FSS (FOUP Storage System)
  • Process technology excellence and development service
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
  • Smart process control and data analysis feature [Framework SW Platform]
    • Integrated analysis features for process and machine control
    • Equipment and process performance tracking feature
    • Parallel/queueing task processing feature
    • Smart handling features
    • Occurrence and alarm analysis
    • Smart maintenance management and tracking

Technical Data

Number of modules
Process modules: up to 6
Bake / chill modules: up to 20
Industrial automation features
Ergo load cassette stations / SMIF loadports / SECS/GEM / FOUP load ports
Smart process control & data analysis features (framework SW platform)
Integrated analysis features for process and machine control
Parallel task / queueing task processing feature
Equipment and process performance tracking feature
Smart handling features
Occurences & alarms analysis / smart maintenance management & tracking
Wafer diameter (substrate size)
Up to 300 mm
Available modules
Spin coat / OmniSpray® / develop
Bake / chill
Wafer handling options
Single/double EE / edge handling / wafer flipping
Bowed / warped / thin wafer handling
Dispense options
Various resist despense pumps to cover a wide range of viscosities up to 52000 cP
Liquid priming / pre-wet / bowl wash
Edge bead removal (EBR) / back-side rinse (BSR)
Constant pressure dispense systems / syringe dispense system
Resist dispense pump features flowmonitoring
Programmable dispense rate / programmable volume / programmable suck-back
Additional module options
Pre-alignment: optical / mechanical
ID-reader: barcode, alpha-numeric, data matrix
System control
Operations system: Windows
File sharing & back-up solution / unlimited no. recipes & parameters / offline recipe editor
Flexible process flow definition / easy drag and drop recipe programming
Parallel processing of multiple jobs / real-time remote access, diagnostics & troubleshooting
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR

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