EVG®150 Automated Resist Processing System up to 300mm

Fully-automated coat/develop process and high-throughput performance.


  • Max. wafer size: up to 200mm; up to 300mm
  • Max. number of process modules: 6 (4 wet modules); 5 (4 wet modules)
  • Max. number of bake/vapour prime/chill plates per module: 6 plates; 4 plates
  • Spray coating: OmniSpray® (x/y or rotational spray coating)
    Spray nozzle programmable parameters: Speed (rpm), acceleration (rpm/s),
    absolute position
    Park position and dummy dispense
  • NanoCoat™ Module:
    Dedicated module to support NanoSpray ™ and NanoFill™ processes
  • Spin coating:
    Drive unit up to 10.000rpm, ramp-up speed up to 40.000 rpm/s
    Park position and dummy dispense
  • Developing:
    Pressurized tank, flow control, flow monitoring
    Nitrogen nozzle for atomizing developer in spray mode; also suitable for puddle
    and stream (rinse) develop
    Park position and dummy dispense
  • Max. hotplate temperature: 350 °C
  • Automation options:
    Resist pumps for spin coating:
    - For resist viscosities up to 50000cP
    - Up to 15ml dispense volume, up to 5ml/s dispense rate
    - Suckback programmable for best uniformity
    Resist pumps for spray coating:
    - Precise flow control 10µl/s up to 200µl/s for low viscosity resist