EVG®805 Semi-Automated Debonding System

For thin wafer debonding. 

 

The EVG805 is a semi-automated system for debonding thin wafers from sapphire, quartz, glass or silicon carriers. Dependent on further process steps of the temporary bonded wafer stack after the initial bonding the debond method and the intermediate adhesive material are chosen. The thin wafer can be unloaded on a single substrate carrier for save and reliable transport between tools.

Features

  • Semi-automated thermal release intermediate layer debonding
  • Recipe controlled system 
  • Unique features for thinned wafer handling
  • Various chuck designs to support wafer/substrates and carriers up to 300 mm

EVG Debonding Technologies

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