The EVG820 lamination station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination onto the wafer. The material usually is a double-side adhesive tape. With punching technology, size and dimension of tape are freely selectable and independent from substrate.
|Wafer diameter (substrate size)|
|Up to 300 mm|
|1 punch unit|
|Bottom side protective liner peel-off|
|Top side protective liner peel-off|