先进封装,三维层叠互联

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.


 
Slider_YoleNCAP2017_2000x525a2017 NCAP & Yole Développement Symposium on Advanced Packaging & System Integration Technology
April 20 - 21, 2017, Wuxi, China
Visit our presentation about "Temporary Bonding for FOWLP and Advanced Packaging" at the 2017 NCAP & Yole Développement Symposium on Advanced Packaging & System Integration Technology.

theconfab-logo976x477ConFab 2017
May 14 - 17, 2017, Hotel del Coronado, San Diego, CA
Visit EVG at The ConFab 2017.

ECTC2017ECTC 2017
May 30 - June 02, 2017, Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, FL
Visit our booth #405 at ECTC 2017.

semiconwestSEMICON West 2017
July 11 - 13, 2017, Moscone Center, San Francisco, CA
Visit our booth at SEMICON West 2017.

cropped-logoiceptICEPT 2017
August 16 - 19, 2017, Harbin, China
Meet us at ICEPT 2017.

empcEMPC 2017
September 10 - 13, 2017, Warsaw University of Technology, Poland

semiconeuropa_logoSEMICON Europa 2017
November 14 - 17, 2017, Messe München, Munich, Germany
Visit us at our booth #B1-1424 at SEMICON Europa 2017.