新闻中心

EV Group Installs Low-Temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo  

2017_12_UniTokyo_thumbnailST. FLORIAN, Austria, December 12, 2017-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. Installed at the university's Takagi & Takenaka Laboratory, the EVG810LT augments the laboratory's research focused on developing novel MOSFET and electronic-photonic integrated circuits (EPICs) using III-V-on-insulator (III-V-OI) and germanium-on-insulator (GeOI) substrates.

更多...
 

Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding With 1-Micron Pitch On EV Group System  

2017_11_Leti_Pitch_ThumbnailST. FLORIAN, Austria and GRENOBLE, France, November 13, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved copper pads as small as 500nm.

更多...
 

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures With Single-Nanometer Accuracy  

2017_10_SwissLitoCollage_thumbnailST. FLORIAN, Austria and ZURICH, Switzerland, October 9, 2017-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and SwissLitho AG, a manufacturer of novel nanolithography tools, today announced a joint solution to enable the production of 3D structures down to the single-nanometer scale. Initially demonstrated within the "Single Nanometer Manufacturing for Beyond CMOS Devices (SNM)" project funded by the Seventh Framework Program of the European Union, the joint solution involves SwissLitho's novel NanoFrazor thermal scanning probe lithography system to produce master templates with 3D structures for nanoimprint lithography (NIL), and EVG's HERCULES® NIL system with SmartNIL® technology to replicate those structures at high throughput.

更多...
 

EuroPAT-MASIP project secures ECSEL funding to bring semiconductor packaging back to Europe  

2017_09_EuroPAT-MASIP_thumbnailThe current trends in automotive industry, consumer electronics, internet of things and big data set growing and diverse needs for electronics manufacturing. As a response to these needs the key players in European semiconductor and MEMS packaging industry have joined forces in an ambitious three-year project EuroPAT-MASIP funded by the Horizon 2020 programme within the “Electronics Components and Systems for European Leadership” (ECSEL). Involving 28 partners throughout the whole European Semiconductor packaging, assembly and testing value chain the project aims to reinforce European position in semiconductor value chain by focusing on semiconductor and MEMS packaging.

更多...
 

EV集团收到多份用于晶圆级光学元件制造的光刻与测量系统订单  

2017_09_Wafer_Level_Optics_Manufacturing_thumbnail 微机电系统(MEMS)、纳米技术以及半导体市场晶圆键合和光刻设备领先供应商EV集团(EVG)今天宣布,该公司制造设备与服务系列已收到多份订单,这些设备与服务旨在满足日益增长的晶圆级光学元件(WLO)与3D传感需求。

更多...
 

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan  

2017_08_EV_Group_Japan_2_ThumbnailST. FLORIAN, Austria, August 2, 2017-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama, EV Group Japan has since expanded its presence to include offices in Fukuoka and a state-of-the-art applications lab in Yokohama for process and product demonstrations, as well as increased the number of employees in the country by nearly three-fold.

更多...
 

EV Group Unveils Breakthrough Low-Temperature Laser Debonding Solution for Fan-out Wafer-Level Packaging  

2017_07_LaserDebonding_1_ThumbnailST. FLORIAN, Austria, July 5, 2017 - EV Group (EVG, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation laser debonding solution, which enables high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin and stacked fan-out packages. Designed as a module for integration in the company's benchmark EVG®850 DB automated debonding system, the new laser debonding solution incorporates a solid-state laser and proprietary beam-shaping optics to enable optimized, force-free debonding.

更多...
 

EV Group Scores Fifth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey  

2017_05_VLSIresearch_2017_Results_Thumbnail

ST. FLORIAN, Austria, June 27, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fifth successive year, it has earned all three awards resulting from VLSIresearch's annual Customer Satisfaction Survey. For 2017, EVG was ranked as one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of THE BEST Suppliers of Fab Equipment, increasing its rankings in both award segments compared to last year. EVG also received a RANKED 1st in Specialty Fab Equipment award again this year. In addition, EVG was recognized as one of THE BEST Suppliers of Fab Equipment to Specialty Chip Makers-a new award category introduced in this year's Customer Satisfaction Survey.


更多...
 

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications  

2017_06_PlasmaDicing_1_ThumbnailST. FLORIAN, Austria, June 20, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG's latest products and process development services support this emerging semiconductor back-end fabrication process by protecting bumps and other topography with highly uniform resist layer and lithographic patterning of narrow dicing streets.

更多...
 

EV Group Expands Production Capacity at Corporate Headquarters in Austria  

2017_05_TestroomBuilding_1_ThumbnailST. FLORIAN, Austria, May 31, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment, the expansion will include the construction of a new building that provides additional production and test capacity for EVG equipment that meets the high cleanliness requirements of the semiconductor industry, as well as that allows for a significant expansion of warehouse space.

更多...
 

EV Group Achieves Industry Milestone With More Than 1100 Wafer Bond Chambers Installed Worldwide  

2017_05_WaferBonding_EVG560(300mm)_ThumbnailST. FLORIAN, Austria, May 16, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved an industry milestone with more than 1100 EVG wafer bonding chambers installed at customer facilities worldwide to date. This milestone cements EVG's technology and market leadership in wafer bonding, which is an enabling process for volume manufacturing of semiconductor advanced packaging, MEMS, CMOS image sensors, and radio frequency (RF) devices.

更多...
 

EV Group Honored As Most Innovative Company in Austria  

2017_03_Innovationspreis_ThumbnailST. FLORIAN, Austria, April 4, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received the 2017 Austrian Innovation Award, known as the "Staatspreis Innovation 2017," for the development of EVG's groundbreaking SmartNIL® nanoimprint lithography technology for micro- and nano-structuring of wafers and other substrates. The highest federal accolade for innovative companies in Austria was presented by Vice Chancellor and Federal Minister Dr. Reinhold Mitterlehner on March 28 at an awards ceremony at the Hall of Sciences in Vienna.

更多...
 

EVG在全球范围已安装超过 1100台晶圆键合腔室,取得行业的里程碑  

2017_03_WaferBondingMilestone_Thumbnail 微机电系统( MEMS )、纳米技术以及半导体市场晶圆键合和光刻设备领先供应商 EV 集团( EVG )今日宣布,目前已在全球范围内客户的工厂安装了超过 1100 EVG 晶圆键合室,取得了行业里程碑。这不仅巩固了 EVG 在晶圆键合方面的技术和市场领导地位,还能够提高半导体先进封装、微电子机械系统( MEMS )以及射频( RF )器件的量产。 EVG®500 EVG®850 GEMINI® 以及 ComBond® 系列胶囊化晶圆键合解决方案对于中国制造商采用最新工艺技术,快速实现量产尤为重要。

更多...
 

EV集团推出全新掩模对准光刻技术突破速度和精度极限  

2017_03_IQAlignerNT_thumbnail 微机电系统( MEMS )、纳米技术以及半导体市场晶圆键合和光刻设备领先供应商 EV 集团( EVG )今日宣布推出 IQ Aligner NT ,旨针对大容量先进封装应用推出的全新自动掩模对准系统。 IQ Aligner NT 光刻机配备了高强度和高均匀度曝光镜头、全新晶圆处理硬件、支持全局多点对准的全 200 毫米和全 300 毫米晶圆覆盖、以及优化的工具软件。与 EVG 此前推出的 IQ Aligner 光刻机相比,产出率和对准精度都提升了两倍。这套系统最大程度地满足了对后端光刻最严苛的要求,成本相较竞争者降低 30%

更多...
 

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding  

2017_01_imec_thumbnailLeuven (Belgium)-Jan. 19, 2017- At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), the world-leading research and innovation hub for nano-electronics and digital technology imec and the leading supplier of wafer-bonding equipment EV Group (EVG) announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. Expanding this collaboration, EVG will become a partner in imec's 3D integration program through a joint development agreement to further improve overlay accuracy in wafer-to-wafer bonding.

更多...