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EV Group Accelerates 3D-IC Packaging Roadmap With Breakthrough Wafer Bonding Technology  

2018_07_SmartViewNT3_A_thumbnailST. FLORIAN, Austria, July 3, 2018-EV Group (EVG) today unveiled the new SmartView® NT3 aligner, which is available on the company's industry benchmark GEMINI® FB XT integrated fusion bonding system for high-volume manufacturing (HVM) applications. Developed specifically for fusion and hybrid wafer bonding, the SmartView NT3 aligner provides sub-50-nm wafer-to-wafer alignment accuracy-a 2-3X improvement-as well as significantly higher throughput (up to 20 wafers per hour) compared to the previous-generation platform.

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EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey  

2018_05_VLSIresearch_thumbnailST. FLORIAN, Austria, June 20, 2018-EV Group (EVG) today announced that customers have once again voted the company one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of the 2018 THE BEST Suppliers of Fab Equipment in the 2018 VLSIresearch Customer Satisfaction Survey, increasing its score in both award segments compared to last year's listings. EVG also received a RANKED 1st in Specialty Fab Equipment award again this year, marking the sixth year in a row that it has received all three customer satisfaction awards.

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Europe's chips stack up  

2018_05_EUREKA_thumbnailMay 17, 2018 - A consortium of French, German and Austrian partners are ensuring Europe's semiconductor industry goes from strength to strength and won the 2018 EUREKA Innovation Award in the "Successful SME - large corporation collaboration" category.

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EV Group Secures Lithography Order from VTT Technical Research Centre for More Than Moore Applications  

2018_05_VTT_ThumbnailST. FLORIAN, Austria, May 15, 2018-EV Group (EVG) today announced that it has received an order for its EVG®120 automated resist processing system from VTT Technical Research Centre of Finland (VTT). An existing customer of EVG's wafer bonding and alignment systems, VTT is among the first to place an order for the newest version of the EVG120 system, which has been enhanced to provide even greater reliability, throughput and process performance compared to the previous-generation platform.

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EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity  

2018_05_Manufacturin_III_A_thumbnailST. FLORIAN, Austria, May 2, 2018-EV Group (EVG) today announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG's "Manufacturing III" facility, which will more than double the floor space for the final assembly of EVG's systems.

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WaveOptics collaborates with EV Group to drive augmented reality (AR) manufacturing at scale  

2018_04_WaveOptics1_thumbnailLondon, 26 April 2018 - WaveOptics, the world leading designer and manufacturer of diffractive waveguides, today announced a collaboration with EV Group (EVG), a leading supplier of wafer bonding and nano-imprint lithography equipment, to bring high-performance augmented reality (AR) waveguides to the mass market at the lowest cost available in the industry today. Waveguides are the key optical component for wearable AR.

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Converts One-third of the Sunlight into Electricity: 33.3 Percent Silicon-based Multi-junction Solar Cell  

2018_04_NatureEnergy_thumbnailResearchers at the Fraunhofer Institute for Solar Energy Systems ISE together with the company EV Group (EVG) have developed a new silicon-based multi-junction solar cell, which can convert exactly one-third of the incident sunlight into useful electricity. This newest result is now published in the renowned scientific magazine Nature Energy.

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EV GROUP 和 IBM 签署激光键合分离技术许可协议  

2017_07_LaserDebonding_2_Thumbnail 奥地利圣弗洛里安, 2018 3 14 ——微机电系统( MEMS )、纳米技术以及半导体市场晶圆键合和光刻设备领先供应商 EV Group EVG )和 IBM (纽约证券交易所代码: IBM )今日宣布,两家公司同意签署一份激光键合分离技术许可协议。 EVG 计划将 IBM 取得专利的“混合激光释放”( Hybrid Laser Release )工艺集成到 EVG 先进且经过验证的临时键合和键合分离设备解决方案中,为大批量制造商提供更高灵活性,让他们能够实施经过优化的临时键合和键合分离工艺流程。 EVG 的设备组合将支持来自 IBM 的更多工艺变种,让客户能够从一系列键合、清洗和测量工艺中做出选择,帮助满足他们的临时键合和键合分离要求及应用。

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EV GROUP在中国赢得关键客户订单,提升其在晶圆级光学元件制造解决方案方面的领导力  

ChinaWLO_A_thumbnail 奥地利圣弗洛里安, 2018 3 13 ——微机电系统( MEMS )、纳米技术以及半导体市场晶圆键合和光刻设备领先供应商 EV Group EVG )今日宣布,赢得了中国晶圆级光学元件( WLO )器件制造商对其晶圆级光学元件( WLO )制造设备的多个关键订单。中国已经成为了晶圆级光学元件( WLO )组件和模块的主要制造中心,这些组件和模块越来越多地被集成到智能手机、音频 / 虚拟现实(增强现实 / 虚拟现实)头戴设备等移动设备中,实现了全新的消费者应用和功能。在中国最新赢得的这些客户订单进一步加强了 EVG 作为晶圆级光学元件( WLO )制造工艺解决方案开拓者和市场领导者的地位。

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