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EV Group Honored As Most Innovative Company in Austria  

2017_03_Innovationspreis_ThumbnailST. FLORIAN, Austria, April 4, 2017 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received the 2017 Austrian Innovation Award, known as the "Staatspreis Innovation 2017," for the development of EVG's groundbreaking SmartNIL® nanoimprint lithography technology for micro- and nano-structuring of wafers and other substrates. The highest federal accolade for innovative companies in Austria was presented by Vice Chancellor and Federal Minister Dr. Reinhold Mitterlehner on March 28 at an awards ceremony at the Hall of Sciences in Vienna.

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EVG在全球范围已安装超过 1100台晶圆键合腔室,取得行业的里程碑  

2017_03_WaferBondingMilestone_Thumbnail 微机电系统( MEMS )、纳米技术以及半导体市场晶圆键合和光刻设备领先供应商 EV 集团( EVG )今日宣布,目前已在全球范围内客户的工厂安装了超过 1100 EVG 晶圆键合室,取得了行业里程碑。这不仅巩固了 EVG 在晶圆键合方面的技术和市场领导地位,还能够提高半导体先进封装、微电子机械系统( MEMS )以及射频( RF )器件的量产。 EVG®500 EVG®850 GEMINI® 以及 ComBond® 系列胶囊化晶圆键合解决方案对于中国制造商采用最新工艺技术,快速实现量产尤为重要。

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EV集团推出全新掩模对准光刻技术突破速度和精度极限  

2017_03_IQAlignerNT_thumbnail 微机电系统( MEMS )、纳米技术以及半导体市场晶圆键合和光刻设备领先供应商 EV 集团( EVG )今日宣布推出 IQ Aligner NT ,旨针对大容量先进封装应用推出的全新自动掩模对准系统。 IQ Aligner NT 光刻机配备了高强度和高均匀度曝光镜头、全新晶圆处理硬件、支持全局多点对准的全 200 毫米和全 300 毫米晶圆覆盖、以及优化的工具软件。与 EVG 此前推出的 IQ Aligner 光刻机相比,产出率和对准精度都提升了两倍。这套系统最大程度地满足了对后端光刻最严苛的要求,成本相较竞争者降低 30%

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Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding  

2017_01_imec_thumbnailLeuven (Belgium)-Jan. 19, 2017- At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), the world-leading research and innovation hub for nano-electronics and digital technology imec and the leading supplier of wafer-bonding equipment EV Group (EVG) announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. Expanding this collaboration, EVG will become a partner in imec's 3D integration program through a joint development agreement to further improve overlay accuracy in wafer-to-wafer bonding.

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