Resist processing technology is widely used for numerous micro- and nanotechnology applications and products addressing different markets, such as advanced packaging, MEMS, MOEMS and sensors, microfluidics, RF devices, photonics and many more. All these application fields bring new challenges for semiconductor device design and manufacturing. Understanding these special requirements and having the flexibility to adapt our systems accordingly are among the unique core competences that EVG brings to the marketplace.
Important advancements by EV Group in lithography technology include proprietary resist coating technologies, such as OmniSpray, revolutionary NanoSpray and NanoFill. These unique technologies are implemented in the EVG100 series of resist processing systems and establish new standards in quality and flexibility for photoresist coating and developing. Designed to support a wide range of process parameters and customer requirements, an extensive range of materials – such as positive and negative resists, polyimides, double-sided coating of thin-resist layers, high-viscosity resists, and edge-protection coatings – can be processed on the EVG100 series. While the importance of resist processing to enable certain process flows is often underestimated and just considered a commodity for standard lithography processes, in many cases it is the key enabling process. For example, patterning on high-topography wafers, LIGA (lithography, electroforming, and molding), temporary bonding, nanoimprint lithography (NIL) and adhesive bonding all rely on advanced coating capabilities and process excellence. EVG has built up many years of spin and spray coating experience for demanding applications and incorporates these learnings into the EVG100 series, where our process know-how can be leveraged to support our customers. As with all EVG processing systems, the equipment can be configured for R&D environments or for high-volume production.