EVG®510 HE

Hot Embossing System

Highly flexible hot embossing system for R&D and small volume production

The EVG510 HE Semi-automated Hot Embossing System is designed for high-precision imprinting of thermoplastic substrates. The equipment is configured with a universal embossing chamber as well as vacuum and contact force capabilities, and manages the whole range of polymers suitable for hot embossing. Together with high-aspect-ratio embossing and multiple de-embossing options, many processes for high-quality nanopattern transfer are offered.


  • For hot embossing applications of polymer substrates and spin-on polymers
  • Automated embossing process
  • EVG's proprietary separate alignment process for optically aligned embossing and imprinting
  • Fully software controlled process execution
  • Closed-loop cooling water supply option
  • External de-embossing and cooling station

Technical Data

Heater size 150 mm 200 mm
Maximum substrate dimension 150 mm 200 mm
Minimum substrate dimension single chips 100 mm
Max Contact Force
10, 20, 60 kN
Max. Temperature
Standard: 350 °C
Optional: 550 °C
Bond chuck system / Alignment system
150 mm heater: EVG®610, EVG®620, EVG®6200
200 mm heater: EVG®6200, MBA300, SmartView® NT
Standard: 0.1 mbar
Optional: 0.00001 mbar

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