Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements.
EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
IR and bond strength measurement of bonded wafer stacks.
Versatile, high-accuracy metrology for bonding and lithography.
High-Speed High-Precision Metrology for 3D and Heterogeneous Integration.
High-throughput, high-resolution metrology for bonded stacks and single wafers.