The EVG820 lamination station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination onto the wafer. The material usually is a double-side adhesive tape. With punching technology, size and dimension of tape are freely selectable and independent from substrate.
Automated, stress-free and void-free lamination of any kind of dry adhesive film onto the carrier wafer
Precision-aligned lamination on carrier wafer
Protective liner peel-off
The dry film lamination station can be integrated into an EVG®850 TB temporary bonding system