EVG®560

Automated Wafer Bonding System

Fully automated wafer bonding system for high-volume manufacturing

The EVG560 automated wafer bonding system accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.

Features

  • Fully automated processing with automated loading and unloading of bond chucks
  • Up to four bond chambers for various bonding processes
  • Compatible with EVG mechanical and optical aligner including SmartView
  • Simultaneous rapid heating and cooling on top and bottom side
  • Automatic loading and unloading of bond chambers and cooling station
  • Remote online diagnostics
EVG560

Technical Data

Maximum heater size (mm)
150, 200, 300
Loading chamber
5-axis robot
Max. bond modules
4

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