EVG's wafer-level optics (WLO) manufacturing solutions enable a multitude of novel optical sensing devices for mobile consumer electronics products. Key examples include 3D sensing (essential for more authentic virtual and augmented reality (VR/AR) user experiences), biometric sensing (increasingly critical for security applications), environmental sensing, infrared (IR) sensing and camera arrays. Other applications include additional optical sensors in smartphones for advanced depth sensing to improve camera autofocus performance, and micro displays.

The market-leading WLO manufacturing portfolio comprises the EVG770 automated UV-nanoimprint lithography (UV-NIL) stepper for step-and-repeat master stamp fabrication, the IQ Aligner UV imprinting system for wafer-level lens molding and stacking, and metrology systems such as the EVG40 NT automated measurement system for alignment verification. EVG's WLO solutions are supported by the company's NILPhotonics Competence Center, which leverages field-proven process and equipment know-how to support emerging photonic applications and significantly shorten time to market through fast process implementation and optimization, as well as through customized equipment design.

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Elements of a typical wafer-level camera module include a CMOS image sensor, polymeric lenses molded onto glass carriers using UV imprint lithography, spacers and aperture layers, as shown in this exploded view.
Source: EVG

Lens pattern fidelity measurement
Source: EVG