IQ Aligner® NT

Automated Mask Alignment System

The IQ Aligner® NT is optimized for zero-assist contactless proximity processing at highest throughput.

The IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. Featuring the most sophisticated print gab control and zero-assist dual-size wafer processing capability, the system fully addresses high-volume manufacturing (HVM) needs. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG’s previous-generation IQ Aligner system, giving it the highest throughput of all mask aligners. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems growing out of the highest throughput supported on mask alignment tools.. With advanced wafer alignment run-out control, full-field mask movement capability and high-power UV light source, it is ideally suited for wafer bumping and interposer patterning, thereby serving a variety of advanced packaging types, including wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP), 3D-IC/through-silicon via (TSV), 2.5D interposers, and flip chip.

Features

  • Zero assist bridge tool - dual substrate concept supporting flexibility of production for 200 mm and 300 mm
  • Throughput > 200 wph (first print)
  • Cutting-edge alignment accuracy
    • Top-side alignment down to 250 nm
    • Back-side alignment down to 500 nm
  • Broadband intensity > 120 mW/cm² (300 mm wafer)
  • Full Clearfield Mask Movement (FCMM) for flexible pattern positioning and compatibility for darkfield mask alignment
  • Contact-free in-situ mask-to-wafer proximity gap verification
  • Excellent run-out compensation thanks to ultra-flat and fast response temperature-controlled wafer chuck
  • Manual substrate loading capability
  • Rework sorting wafer management and flexible cassette system
  • Remote tech support and GEM300 compatibility
  • Smart process control and data analysis feature [Framework Software Platform]
    • Integrated analysis features for process and machine control
    • Equipment and process performance tracking feature
    • Parallel/queueing task processing feature
    • Smart handling features
    • Occurrence and alarm analysis
    • Smart maintenance management and tracking
IQ Aligner NT

Technical Data

Throughput
Fully-automated: throughput first print: 200 wafers per hour
Fully-automated: throughput aligned: 160 wafers per hour
Industrial automation features
Cassette / SMIF / FOUP / SECS/GEM / thin, bowed, warped, edge wafer handling
Smart process control & data analysis features (framework SW platform)
Integrated analysis features for process and machine control
Parallel task / queueing task processing feature
Equipment and process performance tracking feature
Smart handling features
Occurences & alarms analysis / smart maintenance management & tracking
Wafer diameter (substrate size)
Up to 300 mm
Alignment modes
Top side alignment: ≤ ± 0,25 µm
Bottom side alignment: ≤ ± 0,5 µm
IR alignment: ≤ ± 2,0 µm / substrate material depending
Exposure setup
Hard contact / soft contact / proximity mode / flex mode
Wedge compensation
Fully automatic - SW controlled
Contactless
Exposure options
Interval exposure / flood exposure
Advanced alignment features
Automatic alignment
Darkfield alignment capability / full clearfield mask movement (FCMM)
Large gap alignment
Run-out control alignment
System control
Operations system: Windows
File sharing & back-up solution / unlimited no. recipes & parameters
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR
Real-time remote access, diagnostics & troubleshooting

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